參數(shù)資料
型號(hào): AXS632339S
元件分類: 插座
英文描述: SOP32, IC SOCKET
文件頁(yè)數(shù): 3/7頁(yè)
文件大小: 936K
代理商: AXS632339S
AXS6
171
SPECIFICATIONS
1. Characteristics
2. Materials and surface treatment
Item
Sepcications
Conditions
Electrical
characteristics
Rated current
0.5A
Insulation resistance
Min. 1,000M
Using 500V DC megger
Breakdown voltage
500V AC for 1 minute
Detection current: 1mA
Contact resistance
Max. 30m
Measured based on the HP4338B measurement
method of JIS C 5402.
Does not include conductor resistance of IC leads.
Mechanical
characteristics
Shock resistance
981m/s2 {100G}
No interruption of current longer than 1
s
Environmental
characteristics
H2S
After test, contact resistance max. 30m
After 48 hours of exposure to humidity 75 to 80% R.H.,
temperature 40
°C±2°C, concentration 3±1ppm
SO2
After test, contact resistance max. 30m
After 48 hours of exposure to humidity 90 to 95% R.H.,
temperature 40
°C±2°C, concentration 10±3ppm
Humidity
After test, contact resistance max. 30m
,
insulation resistance min. 100M
After 96 hours of exposure to humidity 90 to 95% R.H.,
temperature 40
°C±2°C
Thermal shock resistance
After test, contact resistance max. 30m
,
insulation resistance min. 100M
After 5 cycles where 1 cycle consists of steps 1 to 4
Operating temperature
–55
°C to +85°C
No freezing at low temperatures
Soldering heat resistance
Peak temperature of 245
°C
Infrared reow soldering
Soldering heat resistance
300
°C within 5 seconds
Soldering iron
Suitable IC package
(See page 169.)
8, 14, 20, 24 contacts: SO package IC with nominal dimension 300 mil and 1.27mm pitch
20, 28 contacts:
SO package IC with nominal dimension 375 mil and 1.27mm pitch
28, 32 contacts:
SO package IC with nominal dimension 450 mil and 1.27mm pitch
32, 40 contacts:
SO package IC with nominal dimension 525 mil and 1.27mm pitch
44 contacts:
SO package IC with nominal dimension 600 mil and 1.27mm pitch
Part name
Material
Surface treatment
Molded portion
Body
Glass reinforced PPS (UL94V-0)
Frame
Glass reinforced PPS (UL94V-0)
Contact
Copper alloy
Contact portion: Sn plating over Ni,
Terminal portion: Sn plating over Ni (except for top of the terminal)
Sequence
Temperature (
°C) Time (minutes)
1
–55
30
2
25
Max. 5
385
30
4
25
Max. 5
+0
3
+10
5
+3
0
+10
5
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