參數(shù)資料
型號: B300W35A102E1G
廠商: ON Semiconductor
文件頁數(shù): 5/15頁
文件大小: 0K
描述: IC PROCESSOR AUDIO 24BIT WLCSP
標(biāo)準(zhǔn)包裝: 2,500
系列: BelaSigna® 300
類型: 音頻處理器
應(yīng)用: 便攜式設(shè)備
安裝類型: 表面貼裝
封裝/外殼: 35-VFBGA,WLCSP
供應(yīng)商設(shè)備封裝: 35-WLCSP(3.63x2.68)
包裝: 帶卷 (TR)
13
www.pericom.com
P-0.1
07/18/12
PI74AVC164245
16-Bit 1.2-2.5V to 3.3V Level Shifting Transceiver with 3-State Outputs
Pericom Semiconductor Corporation 1-800-435-2336
Packaging Mechanical: 48-Pin TSSOP (A)
1
.236
.244
.488
.496
.002
.006
SEATING PLANE
.007
.010
.0197
BSC
.004
.008
.319
1
48
12.4
12.6
6.0
6.2
0.50
0.17
0.27
8.1
0.05
0.15
0.09
0.20
X.XX
DENOTES DIMENSIONS
IN MILLIMETERS
.018
.030
0.45
0.75
.047
1.20 Max
BSC
DOCUMENT CONTROL NO.
PD - 1501
REVISION: G
DATE: 03/09/05
Note:
1. Controlling dimensions in millimeters.
2. Ref: JEDEC MO-153F/ED
3. Dimension does not include mold ash, protrusions or gate burrs. Mold ash, protru-
sions and gate burrs shall not exceed 0.15mm per side.
4. Dimension does not include interlead ash or protrusion. Interlead ash or protrusion
shall not exceed 0.25mm per side.
DESCRIPTION: 48-Pin 240-Mil Wide TSSOP
PACKAGE CODE: A
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 www.pericom.com
See Note 3
See Note 4
12-0208
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