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參數(shù)資料
| 型號： | BA792 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Band-switching diode |
| 中文描述： | SILICON, VHF BAND, MIXER DIODE |
| 封裝： | CERAMIC, SMD, 2 PIN |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 44K |
| 代理商： | BA792 |
1996 Mar 13
3
Philips Semiconductors
Product specification
Band-switching diode
BA792
ELECTRICAL CHARACTERISTICS
T
j
= 25
°
C unless otherwise specified.
Note
1.
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
Note
1.
Device mounted on a printed-circuit board measuring 11
×
25
×
1.6 mm.
SYMBOL
PARAMETER
CONDITIONS
MAX.
UNIT
V
F
I
R
forward voltage
reverse current
I
F
= 100 mA
V
R
= 20 V
V
R
= 20 V; T
amb
= 75
°
C
V
R
= 3 V; f = 1 to 100 MHz; note 1
I
F
= 3 mA; f = 200 MHz; note 1
1.1
10
1
1.1
0.7
V
nA
μ
A
pF
C
d
r
D
diode capacitance
diode forward resistance
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient
note 1
315
K/W
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.2).
Dimensions in mm.
Fig.2 SOD110 reflow soldering pattern.
handbook, halfpage
MGC119
3.00
1.25
1.00
1.00
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.3).
Dimensions in mm.
Fig.3 SOD110 wave soldering pattern.
handbook, halfpage
MGC126
3.40
1.25
1.10
1.10
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