參數(shù)資料
型號(hào): BLS3135-10
廠商: NXP SEMICONDUCTORS
元件分類: 功率晶體管
英文描述: Microwave power transistor(微波功率晶體管)
中文描述: S BAND, Si, NPN, RF POWER TRANSISTOR
封裝: HERMETIC SEALED, CERAMIC, SOT-445C, 2 PIN
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 66K
代理商: BLS3135-10
2000 Feb 01
3
Philips Semiconductors
Product specification
Microwave power transistor
BLS3135-10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note
1.
Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
T
j
= 25
°
C unless otherwise specified.
APPLICATION INFORMATION
RF performance at T
h
= 25
°
C in a common-base test circuit.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CBO
V
CES
V
EBO
I
CM
P
tot
T
stg
T
j
T
sld
collector-base voltage
collector-emitter voltage
emitter-base voltage
peak collector current
total power dissipation
storage temperature
operating junction temperature
soldering temperature
open emitter
R
BE
= 0
open collector
t
p
100
μ
s;
δ ≤
10%
t
p
= 100
μ
s;
δ
= 10%; T
h
= 25
°
C
65
75
75
2
1.5
34
+200
200
235
V
V
V
A
W
°
C
°
C
°
C
up to 0.2 mm from ceramic cap; t
10 s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Z
th j-h
thermal impedance from junction to heatsink
t
p
= 100
μ
s;
δ
= 10%; note 1
t
p
= 200
μ
s;
δ
= 10%; note 1
t
p
= 300
μ
s;
δ
= 10%; note 1
5.2
5.8
6.3
K/W
K/W
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
(BR)CBO
V
(BR)CES
I
CBO
I
CES
I
EBO
h
FE
collector-base breakdown voltage
collector-emitter breakdown voltage I
C
= 2.5 mA; V
BE
= 0
collector leakage current
collector leakage current
emitter leakage current
DC current gain
I
C
= 2.5 mA; open emitter
75
75
40
0.3
0.5
0.1
V
V
mA
mA
mA
V
CB
= 40 V; I
E
= 0
V
CE
= 40 V; V
BE
= 0
V
EB
= 1.5 V; I
C
= 0
V
CE
= 5 V; I
C
= 0.25 A
MODE OF OPERATION
f
(GHz)
V
CE
(V)
P
L
(W)
10
G
p
(dB)
7.5
typ. 9
η
C
(%)
35
typ. 40
Class-C; t
p
= 100
μ
s;
δ
= 10%
3.1 to 3.5
40
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