參數(shù)資料
型號: BU-61745G4-650Y
廠商: DATA DEVICE CORP
元件分類: 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72
封裝: 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72
文件頁數(shù): 50/60頁
文件大小: 700K
代理商: BU-61745G4-650Y
54
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
Rev. C
1.00 SQ
±0.01
(25.40
±0.25)
72
1
VIEW "B"
Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL2O3)
3) Lead Material: Kovar, Plated by 50
in.
minimum nickel under 60
in. minimum gold.
4) There are 6 test pads located on the bottom of
the package. These pads are recessed so as
not to interfere when mounting the hybrid.
There are no user connections to these pads.
VIEW "B"
1.38
±0.02
(35.05
±0.51)
0.19
±0.01
(4.83
±0.25)
0.850
±0.008
(21.590
±0.203)
0.08 MIN FLAT
(2.03)
0.155 MAX
(3.94)
0.018
±0.002
(0.457
±0.051)
0.050
±0.005
(1.270
±0.127)
BOTTOM VIEW
SIDE VIEW
VIEW "A"
INDEX DENOTES
PIN NO. 1
P2
P1
P6
P5
P4
P3
0.100 DIA.
(2.540) (see note 4)
0.010
±0.002
(0.254
±0.051)
0.012 R. MAX
(0.305 R.)
0.05 MIN FLAT
(1.27)
1.024 ±0.014 NOM.
(26.010 ±0.356)
VIEW "A"
0.006 -0.004,+0.010
(0.152 -0.100,+ 0.254)
0.050 ±0.005
(1.27 ±0.127)
FIGURE 17. MECHANICAL OUTLINE DRAWING FOR 72-PIN GULL LEAD PACKAGE
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