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參數資料
| 型號： | BU-61843F4-270W |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72 |
| 封裝： | 1 X 1 INCH, 0.155 INCH HEIGHT, CERAMIC, FP-72 |
| 文件頁數： | 51/60頁 |
| 文件大?。?/td> | 700K |
| 代理商： | BU-61843F4-270W |
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55
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
Rev. C
ORDERING INFORMATION
BU-61745F3-120X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Test Criteria:
0 = Standard Testing
2 = MIL-STD-1760 Amplitude Compliant (not available with Voltage/Transceiver
Option 4 “McAir compatible”)
Process Requirements:
0 = Standard DDC practices, no Burn-In
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In
Temperature Range**/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
6 = Custom Part (Reserved)
7 = Custom Part (Reserved)
8 = 0°C to +70°C with Variables Test Data
Voltage/Transceiver Option:
3 = +5 Volts rise/fall times = 100 to 300 ns (-1553B)
4 = +5 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible)(not available with
Test Criteria option 2 “MIL-STD-1760 Amplitude Compliant)
Package Type:
F = 72-Lead Flat Pack
G = 72-Lead “Gull Wing” (Formed Lead)
Logic / RAM Voltage
3 = 3.3 Volt (Applicable only for BU-61743 and BU-61843)
4 = 3.3 and 5 Volt (Applicable only for BU-61864)
5 = 5 Volt
Product Type:
BU-6174 = RT only with 4K x 16 RAM
BU-6184 = BC /RT / MT with 4K x 16 RAM
BU-6186 = BC /RT / MT with 64K x 17 RAM
* Standard DDC processing with burn-in and full temperature test. See table on next page.
** Temperature Range applies to case temperature for Flat Pack and Gull Wing packages.
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