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  • 參數(shù)資料
    型號: BU-61845G3-110
    英文描述: Telecommunication IC
    中文描述: 通信集成電路
    文件頁數(shù): 28/32頁
    文件大?。?/td> 833K
    代理商: BU-61845G3-110
    28
    Data Device Corporation
    www.ddc-web.com
    BU-61559 Series
    C-12/02-300
    1.8(46)
    1.500
    (38)
    1.800 (46)
    DIPIN 1
    2.1(53)
    1.900 (48)
    MAX
    (5.33)
    0.100 TYP (2.54)
    0.050 TYP (1.27)
    (6.35 ±0.25)
    PIN NUMBERS FOR
    1.650
    (42)
    0.01(0.46 ±0.05)
    59
    20
    40
    78
    60
    21
    41
    1
    2
    SEE DETAIL "A"
    DETAIL "A"
    NOTE: DIMENSIONS ARE IN INCHES (MM).
    FIGURE 24. BU-61559D MECHANICAL OUTLINE (78-PIN CERAMIC DDIP)
    0.050 = 1.90
    (1.27 = 48.26)
    0.4(10.16)
    0.(1.27)
    0.(2.54 ±0.25)
    0.210 MAX (5.33)
    39
    40
    1
    78
    1.(45.72)
    NOTES:
    LEAD CLUSTER TO BE CENTRALIZED ABOUT
    CASE CENTER LINE WITHIN ±0.010.
    2. DIMENSIONS ARE IN INCHES (MM).
    0.0(0.46 ±0.05)
    SEE DETAIL "A"
    DETAIL "A"
    1
    PN 1 DENOTED
    BY INDEX TAB
    ON LEAD BRAZE
    2.(53.34)
    0.010 ±0.002 TYP
    (0.25 ±0.05)
    PIN NUMBERS FOR
    1.824 MAX (46.32)
    0.010 (0.254)
    0.050 (1.27) TYP
    1
    FIGURE 25. BU-61559F MECHANICAL OUTLINE (78-PIN CERAMIC FLAT PACK)
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