參數(shù)資料
型號(hào): BU-61860B4-800
廠商: DATA DEVICE CORP
元件分類: 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128
封裝: 0.815 X 0.815 INCH, 0.140 INCH HEIGHT, BGA-128
文件頁數(shù): 53/60頁
文件大小: 763K
代理商: BU-61860B4-800
57
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
D-03/02-250
FIGURE 19. MECHANICAL OUTLINE DRAWING FOR 128-BALL BGA PACKAGE
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
.0394 [1.00]
(TYP)
.815 [20.70]
(MAX)
SQUARE
.670 [17.02]
(TYP)
17 EQ.SP.
.0394 [1.00] = .670 [17.02]
(TOL NONCUM)
(TYP)
.065 [1.65]
(TYP)
.065 [1.65]
(TYP)
.032 [0.81]
(REF)
.022 [0.64] DIA
Sn/Pb BALL
(128 PLACES)
0.140 [3.58]
(MAX)
BOTTOM VIEW
SIDE VIEW
Notes:
1) Dimensions are in inches (mm).
2) Cover material: Diallyl Phthalate (DAP).
3) Base material: FR4 PC board.
4) Ball material: SnPb.
5) Solder Ball Cluster to be centralized within ±.010 of outline dimensions.
Triangle denotes
Ball A1
Cover Material
Diallyl Phthalate (DAP)
FR4 P.C. Board
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