- 您現(xiàn)在的位置：買賣IC網 > PDF目錄166602 > BU-63149D3-570L BGA Spring Pin Sockets; IC Size X (mm): 27; IC Size Y (mm): 27; IC Size Tolerance (mm): 0.2; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Max Pincount: 420; Max Package Code: BGA420C; Full Array: no; IC Ball Height Min (mm): 0.4; IC Ball Height Max (mm): 0.6; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; Part Description: Spring Pin (Pogo) Sockets; PDF資料下載
參數(shù)資料
| 型號： | BU-63149D3-570L |
| 英文描述： | BGA Spring Pin Sockets; IC Size X (mm): 27; IC Size Y (mm): 27; IC Size Tolerance (mm): 0.2; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Max Pincount: 420; Max Package Code: BGA420C; Full Array: no; IC Ball Height Min (mm): 0.4; IC Ball Height Max (mm): 0.6; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; Part Description: Spring Pin (Pogo) Sockets; |
| 中文描述： | 收發(fā)器 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 65K |
| 代理商： | BU-63149D3-570L |
7
ORDERING INFORMATION
BU-63147D3-120X
STANDARD DDC PROCESSING
TEST
MIL-STD-883
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017, and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
A
BURN-IN
1015, Table 1
—
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Text and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Date Code
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source, and 100% Pull Test
Blank = None of the above
Test Criteria:
0 = Standard Testing
2 = MIL-STD-1760 Amplitude Compliant
(Note: The -XX2 option is not available for the BU-63147/49X4 version.)
Process Requirements:
0 = Standard DDC Processing, no Burn-In
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
6 = Custom Part (Reserved)
7 = Custom Part (Reserved)
8 = 0°C to +70°C with Variables Test Data
Rise/Fall Times Option:
3 = Rise/Fall times = 100 to 300 ns
4 = Rise/Fall times = 200 to 300 ns
Package Type:
D = DIP Package
F = Flat Pack
Base Product Type:
BU-63147 = 5V Dual Transceiver, HARRIS Compatible
BU-63149 = 5V Dual Transceiver, SMITHS Compatible
*Standard DDC Processing with burn-in and full temperature test, see table below.
相關PDF資料 |
PDF描述 |
|---|---|
| BU-63149D3-570Q | Transceiver |
| BU-63149D3-570S | Transceiver |
| BU-63149D3-570W | Transceiver |
| BU-63149D3-570Y | Transceiver |
| BU-63149D3-570Z | Transceiver |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BU-63149D3-570Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Transceiver |
| BU-63149D3-570S | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Transceiver |
| BU-63149D3-570W | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Transceiver |
| BU-63149D3-570Y | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Transceiver |
| BU-63149D3-570Z | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Transceiver |
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