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參數(shù)資料
| 型號(hào)： | BU-65178F0-100W |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72 |
| 封裝： | 1 X 1 INCH, LOW PROFILE, CERAMIC, QFP-72 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 141K |
| 代理商： | BU-65178F0-100W |
5
Data Device Corporation
www.ddc-web.com
BU-65178/65179*/61688*/61689*
F1 web-09/02-0
9
8
7
6
5
4
3
2
1
0.800 ±0.005
(20.320 ±0.127)
0.100 ±0.005
(2.540 ±0.127)
TOP VIEW
Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL2O3)
3) Lead Material: Kovar, Plated by 50
in. minimum nickel under 60 in. minimum gold.
J H G F E D C B A
BOTTOM VIEW
1.000 SQ ±0.010
(25.400 ±0.254)
0.180 ±0.008
(4.572 ±0.203)
0.018 ±0.002
(0.457 ±0.051)
0.155 MAX
(3.810)
SIDE VIEW
0.070 ±0.005
(1.778 ±0.127)
0.070 ±0.005
(1.778 ±0.127)
Indicates
Pin A1
FIGURE 3. BU-65178P / 65179P* /61588P /61688P*/61689P* MECHANICAL OUTLINE (PIN GRID ARRAY - PGA)
FIGURE 4. BU-65178G / 65179G* /61588G /61688G*/61689G* MECHANICAL OUTLINE (GULL LEAD)
1.00 SQ
±0.01
(25.40
±0.25)
72
1
VIEW "B"
Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL2O3)
3) Lead Material: Kovar, Plated by 50
in. minimum nickel
under 60
in. minimum gold.
4) There are 8 test pads located on the bottom of the package.
These pads are recessed so as not to interfere when
mounting the hybrid.
VIEW "B"
1.38
±0.02
(35.05
±0.51)
0.19
±0.01
(4.83
±0.25)
0.850
±0.008
(21.590
±0.203)
0.08 MIN FLAT
(2.03)
0.15 MAX
(4.06)
0.018
±0.002
(0.457
±0.051)
0.050
±0.005
(1.270
±0.127)
BOTTOM VIEW
SIDE VIEW
VIEW "A"
INDEX DENOTES
PIN NO. 1
P4
P3
P2
P1
P8
P7
P6
P5
0.100 DIA.
(2.540) (see note 4)
0.010
±0.002
(0.254
±0.051)
0.012 R. MAX
(0.305 R.)
0.05 MIN FLAT
(1.27)
1.024 ±0.014 NOM.
(26.010 ±0.356)
VIEW "A"
0.006 -0.004,+0.010
(0.152 -0.100,+ 0.254)
0.050 ±0.005
(1.27 ±0.127)
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