參數(shù)資料
型號: BUW13F
廠商: NXP SEMICONDUCTORS
元件分類: 功率晶體管
英文描述: Silicon diffused power transistors
中文描述: 15 A, 400 V, NPN, Si, POWER TRANSISTOR
封裝: PLASTIC, SOT-199, 3 PIN
文件頁數(shù): 3/16頁
文件大?。?/td> 105K
代理商: BUW13F
1997 Aug 13
3
Philips Semiconductors
Product specification
Silicon diffused power transistors
BUW13F; BUW13AF
THERMAL CHARACTERISTICS
Notes
1.
2.
Mounted
without
heatsink compound and 30
±
5 N force on centre of package.
Mounted
with
heatsink compound and 30
±
5 N force on centre of package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1.
2.
Mounted
without
heatsink compound and 30
±
5 N force on centre of package.
Mounted
with
heatsink compound and 30
±
5 N force on centre of package.
ISOLATION CHARACTERISTICS
Note
1.
Repetitive peak operation with RH
65% under clean and dust-free conditions.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-h
thermal resistance from junction to external heatsink note 1
3.4
2.5
35
K/W
K/W
K/W
note 2
R
th j-a
thermal resistance from junction to ambient
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CESM
collector-emitter peak voltage
BUW13F
BUW13AF
collector-emitter voltage
BUW13F
BUW13AF
collector saturation current
BUW13F
BUW13AF
collector current (DC)
collector current (peak value)
base current (DC)
base current (peak value)
total power dissipation
V
BE
= 0
850
1000
V
V
V
CEO
open base
400
450
V
V
I
Csat
65
10
8
15
30
6
9
37
50
+150
150
A
A
A
A
A
A
W
W
°
C
°
C
I
C
I
CM
I
B
I
BM
P
tot
see Figs 3 and 4
t
p
< 20 ms; see Fig 4
t
p
=
20 ms
T
h
25
°
C; see Fig.2; note 1
T
h
25
°
C; see Fig.2; note 2
T
stg
T
j
storage temperature
junction temperature
SYMBOL
PARAMETER
MAX.
UNIT
V
isolM
C
isol
isolation voltage from all terminals to external heatsink (peak value); note 1 2000
isolation capacitance from collector to external heatsink
V
pF
21
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