參數(shù)資料
型號(hào)： BX80532KE2000D
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 2000 MHz, MICROPROCESSOR, XMA
文件頁(yè)數(shù)： 84/102頁(yè)
文件大?。?/td> 1464K
代理商： BX80532KE2000D
82
Intel Xeon Processor with 533 MHz Front Side Bus at 2 GHz to 3.20 GHz
7.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor passive heatsink and
the PWT.
Proper clearance is required around the heatsink to ensure proper installation of the processor and
unimpeded airflow for proper cooling.
7.2.1
Boxed Processor Heatsink Dimensions
The boxed processor is shipped with an unattached passive heatsink. Clearance is required around
the heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and
dimensions for the boxed processor with assembled heatsink are shown in Figure 26 (Multiple
Views). The airflow requirements for the boxed processor heatsink must also be taken into
consideration when designing new baseboards and chassis. The airflow requirements are detailed
in the Thermal Specifications, Section 7.4.
7.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weighs no more than 450 grams. See Chapter 3.0 and Chapter 5.0 of
this document along with the Intel XeonTM Processor Family Thermal Design Guidelines for
details on the processor weight and heatsink requirements.
7.2.3
Boxed Processor Retention Mechanism and Heatsink Supports
The boxed processor requires processor retention solution to secure the processor, the baseboard,
and the chassis. The retention solution contains one retention mechanisms and two retention clips
per processor. The boxed processor ships with retention mechanism, cooling solution retention
clips, and direct chassis attach screws.Baseboards and chassis designed for use by system integra-
tors should include holes that are in proper alignment with each other to support the boxed proces-
sor. Refer to the Server System Infrastructure Specification (SSI-EEB) at http://www.ssiforum.org
for details on the hole locations. Please refer to the “Boxed integration notes” at http://sup-
port.intel.com/support/processors/xeon for retention mechanism installation instructions. Retention
mechanism clips must interface with the boxed processor heatsink area shown in Detail A in Figure
The retention mechanism that ships with the boxed processor is different than the reference solu-
tion from Intel. Please refer to Figure 24 below, which contains the dimensions for the reference
solution. Please refer to Figure 25 for the retention mechanism that ships with the boxed processor.
相關(guān)PDF資料
PDF描述
BX80532KC1900E 1900 MHz, MICROPROCESSOR
BU-61582D0-290S 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D0-300K 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D1-391Q 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-61582D1-410S 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BX80532KE2000DU 制造商:Intel 功能描述:XEON 2.0GHZ 533FSB 1U - Boxed Product (Development Kits)
BX80532KE2400DSL73L 制造商:Intel 功能描述:
BX80532KE2400E 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits)
BX80532KE2400EU 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.4GHZ - Boxed Product (Development Kits)
BX80532KE2667D 制造商:Intel 功能描述:MPU XEON PROCESSOR NETBURST 64-BIT 0.13UM 2.66GHZ - Boxed Product (Development Kits)
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