參數(shù)資料
型號(hào): BX805555060P
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, MICROPROCESSOR, BGA771
封裝: LGA-771
文件頁(yè)數(shù): 74/104頁(yè)
文件大?。?/td> 3690K
代理商: BX805555060P
Dual-Core Intel Xeon Processor 5000 Series Datasheet
71
Thermal Specifications
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-2 for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (Refer to Section 6.2 for details on TCC activation.)
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-3 for
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Dual-Core Intel Xeon processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Figure 6-1. Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profiles A
and B
40
45
50
55
60
65
70
75
80
85
0
10
20
30
405060708090
100
110
120
130
Pow e r [W]
T
c
as
e
[
C
]
Thermal Profile B
Y = 0.260*x + 44.2
Thermal Profile A
Y = 0.203*x + 42.6
TCASE_M AX is a thermal solution design point. In actuality, units w ill not significantly
exceed TCASE_M AX_A due to TCC activation.
TCASE_MAX_B@ TDP
TCASE_MAX_A@ TDP
40
45
50
55
60
65
70
75
80
85
0
10
20
30
405060708090
100
110
120
130
Pow e r [W]
T
c
as
e
[
C
]
Thermal Profile B
Y = 0.260*x + 44.2
Thermal Profile A
Y = 0.203*x + 42.6
TCASE_M AX is a thermal solution design point. In actuality, units w ill not significantly
exceed TCASE_M AX_A due to TCC activation.
TCASE_MAX_B@ TDP
TCASE_MAX_A@ TDP
Table 6-2.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A
Table
Power (W)
TCASE_MAX (° C)
Power (W)
TCASE_MAX (° C)
P_profile_min_A=36.5
50.0
85
59.9
40
50.7
90
60.9
45
51.7
95
61.9
50
52.8
100
62.9
55
53.8
105
63.9
60
54.8
110
64.9
65
55.8
115
65.9
70
56.8
120
67.0
75
57.8
125
68.0
80
58.8
130
69.0
相關(guān)PDF資料
PDF描述
BX805555080P 64-BIT, MICROPROCESSOR, BGA771
BX805555080A 64-BIT, MICROPROCESSOR, BGA771
BX805555030P 64-BIT, MICROPROCESSOR, BGA771
BX80557E2140 MICROPROCESSOR, PBGA775
BXM80526B600128 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BX805555060P S L96A 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6
BX805565120P S L9RY 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box
BX805565130A S LAGC 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET
BX805565140P S LABN 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5140 RISC 64-Bit 65nm 2.33GHz 1.35V/1.5V 771-Pin FCLGA6 Box
BX805565148A S LABH 制造商:Intel 功能描述:MPU Xeon