參數(shù)資料
型號(hào): BXM80526B700
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
封裝: MICRO, PGA2-495
文件頁(yè)數(shù): 1/85頁(yè)
文件大?。?/td> 795K
代理商: BXM80526B700
Datasheet
Order Number: 245483-003
Mobile Intel Pentium
III
Processor in BGA2 and Micro-
PGA2 Packages
Featuring Intel SpeedStep Technology at
850 MHz, 800 MHz, 750 MHz, 700 MHz, and
Low-voltage 600 MHz
Datasheet
Product Features
!
Processor core/bus speeds:
Featuring Intel
SpeedStepTM
technology: 850/100 MHz ( Maximum
Performance Mode at 1.60V) and
700/100 MHz (Battery Optimized Mode
at 1.35V)
Featuring Intel
SpeedStepTM
technology: 800/100 MHz ( Maximum
Performance Mode at 1.60V) and
650/100 MHz (Battery Optimized Mode
at 1.35V)
Featuring Intel
SpeedStepTM
technology: 750/100 MHz ( Maximum
Performance Mode at 1.60V) and
600/100 MHz (Battery Optimized Mode
at 1.35V)
Featuring Intel
SpeedStepTM
technology: 700/100 MHz ( Maximum
Performance Mode at 1.60V) and
550/100 MHz (Battery Optimized Mode
at 1.35V)
Featuring Intel
SpeedStepTM
technology: 600/100 MHz ( Maximum
Performance Mode at 1.35V) and
500/100 MHz (Battery Optimized Mode
at 1.10V)
!
Supports the Intel Architecture with
Dynamic Execution
!
On-die primary 16-Kbyte instruction cache
and 16-Kbyte write-back data cache
!
On-die second level cache (256-Kbyte)
!
Integrated GTL+ termination
!
Integrated math co-processor
!
Intel Processor Serial Number
!
BGA2 and Micro-PGA2 packaging
technologies
Supports thin form factor notebook
designs
Exposed die enables more efficient
heat dissipation
!
Fully compatible with previous Intel
microprocessors
Binary compatible with all
applications
Support for MMX technology
Support for Streaming SIMD
Extensions
!
Power Management Features
Quick Start and Deep Sleep modes
provide low power dissipation
!
On-die thermal diode
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