參數(shù)資料
型號(hào): BYV27
廠商: NXP Semiconductors N.V.
英文描述: Ultra fast low-loss controlled avalanche rectifiers
中文描述: 超高速低損失控制雪崩整流器
文件頁數(shù): 2/16頁
文件大小: 110K
代理商: BYV27
1997 Nov 24
2
Philips Semiconductors
Product specification
Ultra fast low-loss
controlled avalanche rectifiers
BYV27 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using
a high temperature alloyed
construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
Fig.1 Simplified outline (SOD57) and symbol.
2/3 page (Datasheet)
MAM047
a
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
RRM
repetitive peak reverse voltage
BYV27-50
BYV27-100
BYV27-150
BYV27-200
BYV27-300
BYV27-400
BYV27-500
BYV27-600
continuous reverse voltage
BYV27-50
BYV27-100
BYV27-150
BYV27-200
BYV27-300
BYV27-400
BYV27-500
BYV27-600
average forward current
BYV27-50 to 200
BYV27-300 and 400
BYV27-500 and 600
average forward current
BYV27-50 to 200
BYV27-300 and 400
BYV27-500 and 600
50
V
V
V
V
V
V
V
V
100
150
200
300
400
500
600
V
R
50
V
V
V
V
V
V
V
V
100
150
200
300
400
500
600
I
F(AV)
T
tp
= 85
°
C; lead length = 10 mm;
see Figs 2, 3 and 4;
averaged over any 20 ms period;
see also Figs 14, 15 and 16
2.0
1.9
1.6
A
A
A
I
F(AV)
T
amb
= 60
°
C; printed-circuit board
mounting (see Fig. 25);
see Figs 5, 6 and 7;
averaged over any 20 ms period;
see also Figs 14, 15 and 16
1.30
1.25
1.10
A
A
A
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