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參數(shù)資料
| 型號： | C222T |
| 廠商： | KEMET Corporation |
| 英文描述： | MILITARY SPECIFCATIONS ON BACK |
| 中文描述： | 背面軍事SPECIFCATIONS |
| 文件頁數(shù)： | 13/40頁 |
| 文件大?。?/td> | 509K |
| 代理商： | C222T |
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KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
13
Within specified tolerance when measured with 1 volt rms
at 1 kHz (1000 pF or less at 1 MHz for C0G).
Dissipation Factor:
25°C at 1 kHz (1000 pF or less at 1 MHz for C0G).
C0G – .15% maximum
X7R – 2.5% maximum
Insulation Resistance:
After 2 minutes electrification at 25°C and rated voltage
C0G – 100K megohms or 1000 megohm - μF, whichever
is less.
X7R – 100K megohms or 1000 megohm - μF, whichever
is less.
Dielectric Withstanding Voltage:
250% of rated voltage for 5 seconds with current limited
to 50 mA at 25°C.
Life Test:
2000 hours at 200% of rated voltage at 125°C. Post-Test
limits at 25°C are:
Capacitance Change:
C0G – less than 3% or 0.25 pF, whichever is higher
X7R – ±20% of initial value
Dissipation Factor:
C0G – .25% maximum
X7R – 3.0% maximum
is less
X7R – 10K megohms or 100 megohm - μF, whichever
is less
Dielectric Withstanding Voltage:
250% of rated voltage for 5 seconds with current
limited to 50 mA.
InsC0G – 10K megohms or 100 megohm - μF, whichever
at 25°C are:
Insulation Resistance:
C0G – 10K megohms or 100 megohm - μF, whichever
is less
X7R – 10K megohms or 100 megohm - μF, whichever
is less
Solderability:
MIL-STD-202, Method 208, Sn62 solder, 245°C for 5 ±1/2
seconds.
Resistance to Soldering Heat:
MIL-STD-202, Method 210, Condition B (260°C, 10 secs).
Depth of immersion — to a minimum of .050" from the
capacitor body.
Lead Material:
Axial: Solder-coated copper clad steel
Radial: Solder-coated copper
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