.125" CENTER-TO-CENTER
.250" ROW-TO-ROW
DIP SOLDER TAILS
.300" CARD SLOT DEPTH
PHYSICAL PROPERTIES
INSULATION RESISTANCE: 5000 megohms minimum.
INSERTION/WITHDRAWAL FORCE (DAUGHTER CARD):
8 oz./2oz. average contact pair using .0620 steel
blade.
INSULATOR BODY: High temp. glass filled
thermoplastic, UL rating 94V-O.
COLOR: Black
CONTACTS: High strength copper alloy.
CONTACT PLATING: 50 microinches nickel
underplate with 30 microinches gold in the mating
area, tin/lead on tails, 100 microinches minimum
ELECTRICAL PROPERTIES
OPERATION VOLTAGE: 1000 VDC (sea level)
CURRENT RATING: 3 Amperes
INITIAL CONTACT RESISTANCE: 10 milliohms
ENVIRONMENTAL PROPERTIES
OPERATING TEMPERATURE: -55C to +125C
TEMPERATURE CYCLING: MIL-STD-202 method 107
VIBRATION: MIL-STD-202 method 204
DAUGHTER CARD
See page 347 for layout
Cardedge
Cantilever Beam–Dip Solder
354
Thomas & Betts Electronics/OEM Division Tel: 901-252-5000 Fax: 901-252-1312
Dimensions shown are for reference only. Dimensions are in inches.
LR49571
E60980
Mounting Styles
.250
.125
.250
.125