
CAT24C03
16
Doc. No. 1113, Rev. A
2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
TAPE AND REEL
Direction of Feed
Device Orientation
Reel Dimensions
(1)
Embossed Carrier Dimensions
Tape
Size
A
B Min
C
D* Min
N Min
G
T Max
14.4
(0.566)
18.4
(0.724)
Max
Qty/Reel
8MM
330
(13.00)
3000
1.5
(0.059)
12.80 (0.504)
13.20 (0.5200)
20.2
(0.795)
50
(1.969)
8.4 (0.328)
9.9 (1.389)
12.4 (0.488)
14.4 (0.558)
12MM
Embossed Carrier Dimensions
Component
8L SOIC
8L TDFN 2x3mm
Package Type
W, Y
VP2
Tape Size (W)
12mm
8mm
Part Pitch (P)
8mm
4mm
Note:
(1) Metric dimensions will govern; English measurements rounded, for reference only and in parentheses.
EMBOSSED
CARRIER
TOP COVER
TAPE THICKNESS (t
)
0.10mm (0.004) MAX THICK
EMBOSSMENT
DEVICE ORIENTATION
SOIC
SPROKET HOLE
TSSOP
TDFN
PIN 1
PIN 1
PIN 1
A
D*
B*
DRIVE SPOKES OPTIONAL, IF USED
ASTERISKED DIMENSIONS APPLY.
*
FULL RADIUS*
TAPE SLOT IN CORE
FOR TAPE START.
2.5mm (0.098) MIN WIDTH
10mm (0.394) MIN DEPTH
G (MEASURED AT HUB)
C
N
T
40mm (1.575) MIN.
ACCESS HOLE
AT SLOT LOCATION