參數(shù)資料
型號: CCK-1205SF
元件分類: 電源模塊
英文描述: 1-OUTPUT 1.5 W DC-DC REG PWR SUPPLY MODULE
封裝: 28 X 7.80 X 16 MM, METAL CASE-6
文件頁數(shù): 3/11頁
文件大?。?/td> 188K
代理商: CCK-1205SF
(11/11)
003-01 / 20051203 / ea335_cc.fm
All specifications are subject to change without notice.
Characteristics, Functions, and Applications
COMMON MODE NOISE
To reduce the common mode noise, connect a capacitor of 0 to
1000pF between the primary side and the secondary side. Be
careful with this connection; a coupling capacitance between the
input and the output becomes high if a too big capacitor is con-
nected.
Furthermore, care should be taken for the withstand voltage of the
capacitor (500V or higher is desirable from the viewpoint of the
insulation and high voltage safety requirements).
If the converter is used not as an insulation type, but as a non-
insulation type, a short circuit is required between the GND termi-
nal of the primary side and that of the secondary side.
RADIATED NOISE
Radiated noise of the converter is reduced by connecting a ground
terminal of the case to the GND of an input or of an output.
It should be noted, however, that its effect depends upon a device
to be used. In addition, the wiring pattern should be made on a bot-
tom surface of the converter in a plain pattern with a GND line, if
possible.
SERIES AND PARALLEL CONNECTIONS
SERIES CONNECTION
It is possible to form a series connection with wiring as shown
below. When the output voltage is not turned on with this connec-
tion, connect Schottky barrier diodes having a forward voltage that
is as low as possible, as shown below.
The Schottky barrier diodes used for this purpose should have a
reverse withstand voltage twice or more the voltage between the
+Vout and –Vout terminals. The output current should be used at a
level equal to or lower than the smaller rated current of the con-
verters.
PARALLEL OPERATION
Parallel operation to increase output current is not possible.
SOLDERING CONDITIONS
Soldering dip: 260°C, 10s max.
Soldering iron: 350°C, 3s max.
CLEANING CONDITIONS
It is recommended that the PC board should not be cleaned after
soldering. It, however, has already been checked that there is no
problem as a result of the following cleaning tests.
When cleaning with one of the following cleaning agents, it should
be used under these conditions. When using cleaning agent other
than the following, please consult TDK before use.
CLEANING AGENTS AND TEST CONDITIONS
Clean Through 750H (Kao Corporation)
(1) Cleaning (Agitation) 60°C/4min
(2) Rinsing (Agitation, water) 60°C/8min
(3) Drying 70°C/6min
Pine Alpha ST100S (Arakawa Chemical Industries, Ltd.)
(1) Cleaning (Agitation) 60°C/5min
(2) Rinsing (Agitation, water) 60°C/3min
(3) Drying 70°C/6min
Terpene Cleaner EC-7R
(1) Cleaning (Agitation) 60°C/5min
(2) Rinsing (Agitation, IPA) 30°C/10min
(3) Drying 70°C/6min
Isopropyl Alcohol (Tokuyama Corp., etc.)
(1) Ultrasonic cleaning 60°C/1min
(2) Cooling bath cleaning R.T./1min
(3) Vapor cleaning 83°C/1min
Load
+Vout
Vout
+Vout
Vout
+Vout
Vout
+Vout
Vout
Load
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