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參數(shù)資料
| 型號： | CD2010-B140 |
| 廠商： | BOURNS INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | CD2010-B140 - Surface Mount Schottky Rectifier Diode |
| 中文描述： | 1 A, 40 V, SILICON, SIGNAL DIODE |
| 封裝： | ROHS COMPLIANT PACKAGE-2 |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 441K |
| 代理商： | CD2010-B140 |
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD2010-B140 – Surface Mount Schottky Rectifier Diode
Features
■
Lead free as standard
■
RoHS compliant*
■
Low profile
■
Low power loss, high efficiency
■
UL 94V-0 classification
Applications
■
High frequency switching power supplies
■
Inverters
■
Free wheeling
■
Polarity protection
General Information
Electrical Characteristics (@ TA= 25 °C Unless Otherwise Noted)
Thermal Characteristics (@ TA= 25 °C Unless Otherwise Noted)
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components. Bourns offers Schottky Rectifier Diodes for rectification applications, in
compact chip package 2010 size format, which offers PCB real estate savings and
are considerably smaller than most competitive parts. The Schottky Rectifier Diodes
offer a forward current of 1 A with a repetitive peak reverse voltage of 40 V.
Bourns
Chip Diodes conform to JEDEC standards, are easy to handle on standard
pick and place equipment and their flat configuration minimizes roll away.
Parameter
Symbol
Min.
Nom.
Max.
Unit
DC Blocking Voltage
V
DC
40
V
Repetitive Peak Reverse Voltage
V
RRM
40
V
Average Forward Rectified Current
1
I
(AV)
1.0
A
Instantaneous Forward Voltage @ I
F
= 1.0 A
V
F
0.45
0.55
V
Reverse Leakage Current @ V
RRM
I
R
0.1
mA
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
(JEDEC Method)
I
FSM
70
A
Parameter
Symbol
Min.
Nom.
Max.
Unit
Junction Temperature Range
T
J
-40
+25
+125
°C
Storage Temperature Range
T
STG
-40
+25
+125
°C
Notes:
1 See Forward Derating Curve.
Tin Plated
Connectors
FRP Substrate
and Epoxy
Underfill
6
*RHSCOMPIAN
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