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參數(shù)資料
| 型號： | CDR32BX109ADWM |
| 廠商： | KEMET Corporation |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 949K |
| 代理商： | CDR32BX109ADWM |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
20°
Maximum
component rotation.
Typical
component
center line
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
8mm
and
12mm
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
1.75 ±0.10
(.069 ±0.004)
4.0 ± 0.10
(.157 ± 0.004)
2.0 ± 0.05
(.079 ± 0.002)
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
Table 1
Tape
Size
D0
P0
E
P2
T1
G1
G2
R Min.
8mm
1/2
Pitch
2.0 ± 0.10
(.079 ±.004)
See Require-
ments
Section 3.3 (d)
3.5 ± 0.05
(.138 ± .002)
8.0 ± 0.3
(.315 ± 0.012)
See Note 1
Table 1
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
Compositions.
See Note 3.
Tape
Size
P1
W
F
A0B0
T
8mm
4.0 ± 0.10
(0.157 ± .004)
12mm
4.0 ± 0.10
(0.157 ± .004)
12mm
Double
Pitch
8.0 ± 0.10
(0.315 ± .004)
12.0 ± 0.3
(.472 ± .012)
5.5 ± 0.05
(.217 ± .002)
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
Sketch C:
Component Rotation - Top View
A0
B0
P1
P0
P2
D0
F
E
W
Center lines
of cavity
10 pitches cumulative
tolerance on tape
±0.2 (±0.008)
Top
Tape
Cover
T
User Direction of Feed
T1
Max. Cavity Size
See Note 1
Table 1
Bottom
Tape
Cover
G2
R
(Min.)
Sketch A:
Bending Radius
See Note 2
Table 1
CERAMIC CHIP CAPACITORS
Packaging Information
96
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CDR32BX109ADWP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSR | CERAMIC CHIP/MIL-PRF-55681 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CDR32BX109ADWP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109ADWR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSM | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSP | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSR | 制造商:KEMET 制造商全稱:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
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