參數(shù)資料
型號(hào)： CDR32BX109BBSP
廠商： KEMET Corporation
元件分類(lèi)： 電容
英文描述： CERAMIC CHIP/MIL-PRF-55681
中文描述： 陶瓷芯片/mil-prf-55681
文件頁(yè)數(shù)： 7/10頁(yè)
文件大小： 949K
代理商： CDR32BX109BBSP
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
Z
2.14
2.78
3.30
4.50
5.90
7.00
G
0.28
0.68
0.70
1.50
2.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.80
1.85
C(ref)
1.21
1.73
2.00
3.00
4.10
5.15
Z
3.18
3.70
4.90
G
0.68
0.70
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
Smin
1.93
2.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
C
X
Grid
Placement
Courtyard
G
Y
Z
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
Packaging
相關(guān)PDF資料
PDF描述
CDR32BX109BBSR CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBUM CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBUP CERAMIC CHIP/MIL-PRF-55681
CDR63BNP-390LC 1 ELEMENT, 39 uH, GENERAL PURPOSE INDUCTOR, SMD
CDR74BNP-470LC 1 ELEMENT, 47 uH, GENERAL PURPOSE INDUCTOR, SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CDR32BX109BBSR 制造商:KEMET 制造商全稱(chēng):Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBUM 制造商:KEMET 制造商全稱(chēng):Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBUP 制造商:KEMET 制造商全稱(chēng):Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBUR 制造商:KEMET 制造商全稱(chēng):Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
CDR32BX109BBWM 制造商:KEMET 制造商全稱(chēng):Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681
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