參數(shù)資料
型號: CG0603MLA-18KG
廠商: Bourns Inc.
英文描述: MLA Series Varistor ESD Clamp Protectors
中文描述: 重點系列壓敏電阻的ESD鉗位保護(hù)器
文件頁數(shù): 3/4頁
文件大?。?/td> 277K
代理商: CG0603MLA-18KG
ChipGuard
MLA Series Varistor ESD Clamp Protectors
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Product Dimensions
DIMENSIONS =
MM
(INCHES)
L
W
B
A
Recommended Pad Layout
A
C
B
D
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under
30 watts is recommended.
Solder Reflow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
T
°
C
120 sec. (min.)
Preheat Stages 1-3
Soldering
Cooling
Time (seconds)
Dimension
CG0402MLA
Series
CG0603MLA
Series
L
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
W
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
A
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
B
0.25 ± 0.15
(0.010 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
CG0402MLA
Series
CG0603MLA
Series
A
0.51
(0.020)
0.76
(0.030)
B
0.61
(0.024)
1.02
(0.040)
C
0.51
(0.020)
0.50
(0.020)
D
1.70
(0.067)
2.54
(0.100)
A
Stage 1 Preheat Ambient to Preheating
Temperature
30 s to 60 s
B
Stage 2 Preheat 140 °C to 160 °C
60 s to 120 s
C
Stage 3 Preheat Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
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