參數(shù)資料
型號: CHFP6KE15
廠商: MICROSEMI CORP-SCOTTSDALE
元件分類: 參考電壓二極管
英文描述: Patented Flip-Chip Series
中文描述: 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE
封裝: FLIP CHIP-2
文件頁數(shù): 2/3頁
文件大小: 60K
代理商: CHFP6KE15
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000
CHFP6KE5.0 thru CHFP6KE170CA
ATTACHMENT AND CONFORMAL COATING
INSTRUCTIONS
FOR Flip-Chip COMPONENTS
The .010” thick tab standoffs minimize shorting during attachment; however, minimal
solder/conductive epoxy must be used and carefully controlled to prevent excess
attachment material from wicking up the side of the tab and shorting across the junction.
Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for vapor-
phase reflow. For flip-chip protection, coating material is Stycast 2651-40 low-viscosity
epoxy manufactured by Emerson & Cuming. Follow instructions carefully for preparation
of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips have been
baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture immediately
prior to coating. Epoxy-coating material should be dispensed around the edges of the chip
with an appropriately sized syringe after which epoxy is de-aired to remove bubbles
entrapped beneath the chip. Cure epoxy as instructed by the supplier.
PEAK PULSE POWER Vs PULSE TIME
PEAK PULSE
POWER DERATING
TP – PULSE TIME – SEC
TEMPERATURE °C
P
pp
PEAK
PULSE
PO
WER
kW
Peak
Pulse
Power
(P
PP
)or
Current
(I
PP
)
In
percent
of
25°
C
rating
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