參數(shù)資料
型號: CS3717AGNF16
廠商: ON SEMICONDUCTOR
元件分類: 運動控制電子
英文描述: STEPPER MOTOR CONTROLLER, 1 A, PDIP16
封裝: 0.300 INCH, PLASTIC, MS-001, DIP-16
文件頁數(shù): 7/8頁
文件大?。?/td> 72K
代理商: CS3717AGNF16
7
Application Circuit - Two Phase Bipolar Stepper Motor Driver
1
VS
1k
RC
CC
0.1
F
CS-3717A
C2
C1 100
F
820pF
1k
RC
1
RSense
CC
820pF
CT
820pF
CT
820pF
Comp In
Gnd
IN0
56k
RT
56k
RT
CS3717A
IMA
IMB
MBA
MAA
STEPPER
MOTOR
VSS
0.1
F C3
FROM
PROCESSOR
Gnd
Sense
Out B
OutA
V
DD
A
V
DD
B
V
CC
VREF
IN1
DIRECTION
Pulse
VCC
VREF
Sense
Gnd
Pulse
DIRECTION
IN0
IN1
VDD
A
OUTA
OUTB
VDD
B
Gnd
RSense
CS3717A
COMP IN
The RΘJA of the CS3717A can be reduced by soldering the
Gnd pins to a suitable copper area of the printed circuit
board or to an external heatsink.
The diagram of fig. 2 shows the maximum dissipated
power Ptot and the RΘJA as a function of the side “l(fā) ” of
two equal square copper areas having a thickness of 35
(see fig. 1). In addition, it is possible to use an external
heatsink (see fig. 3). During soldering the pins tempera-
ture must not exceed 260°C and the soldering time must
not be longer than 12 seconds.
The external heatsink or printed circuit copper area must
be connected to electrical ground.
Mounting Instructions
Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal
Resistance vs. Size “l(fā)” for 16 lead fused package.
1
2
3
4
Ptot
(W)
10
20
30
40
I(mm)
0
20
40
60
80
(C/W)
0
“l(fā)”
Ptot (Tamb = 70C)
Rθ JA
l
COPPER AREA 35
THICKNESS
P.C. BOARD
Figure 1 - Example of P.C. Board Copper Area Which is Used as
Heatsink with 16 lead fused package.
170mm
38.0mm
11.9mm
0
-50
1
2
3
4
5
Ptot
(W)
0
50
100
Tamb (C)
FREE
AIR
HEA
T -
SINK
WITH
R
th = 25C/W
WITH
INFINITE
HEA
T
-
SINK
Figure 3 - External Heatsink Mounting Example (Rth = 30°C/W) for 16
lead batwing package.
Figure 4 - Maximum Allowable Power Dissipation vs. Ambient
Temperature for 16 lead batwing package.
CS3717A
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