3
82C54
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage. . . . . . . . . . . . GND-0.5V to VCC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
CX82C54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
IX82C54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
MD82C54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Thermal Resistance (Typical)
θJA (oC/W) θJC (oC/W)
CERDIP Package. . . . . . . . . . . . . . . . .
55
12
CLCC Package . . . . . . . . . . . . . . . . . .
65
14
PDIP Package* . . . . . . . . . . . . . . . . . .
55
N/A
PLCC Package. . . . . . . . . . . . . . . . . . .
60
N/A
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature Ceramic Package . . . . . . . +175°C
Maximum Junction Temperature Plastic Package. . . . . . . . . +150°C
Maximum Lead Temperature Package (Soldering 10s) . . . . +300°C
(PLCC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2250 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
DC Electrical Specifications
VCC = +5.0V ± 10%, Includes all Temperature Ranges
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITIONS
VIH
Logical One Input Voltage
2.0
-
V
CX82C54, IX82C54
2.2
-
V
MD82C54
VIL
Logical Zero Input Voltage
-
0.8
V
-
VOH
Output HIGH Voltage
3.0
-
V
IOH = -2.5mA
VCC -0.4
-
V
IOH = -100
μA
VOL
Output LOW Voltage
-
0.4
V
IOL = +2.5mA
II
Input Leakage Current
-1
+1
μA
VIN = GND or VCC
DIP Pins 9,11,14-16,18-23
IO
Output Leakage Current
-10
+10
μA
VOUT = GND or VCC
DIP Pins 1-8
ICCSB
Standby Power Supply Current
-
10
μAVCC = 5.5V, VIN = GND or VCC,
Outputs Open, Counters
Programmed
ICCOP
Operating Power Supply Current
-
10
mA
VCC = 5.5V,
CLK0 = CLK1 = CLK2 = 8MHz,
VIN = GND or VCC,
Outputs Open
Capacitance
TA = +25oC; All Measurements Referenced to Device GND, Note 1
SYMBOL
PARAMETER
TYP
UNITS
TEST CONDITIONS
CIN
Input Capacitance
20
pF
FREQ = 1MHz
COUT
Output Capacitance
20
pF
FREQ = 1MHz
CI/O
I/O Capacitance
20
pF
FREQ = 1MHz
NOTE:
1. Not tested, but characterized at initial design and at major process/design changes.