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| 型號： | CXXXEZ700-SXX000 |
| 廠商： | Cree, Inc. |
| 英文描述： | Cree㈢ EZ700⑩ LED |
| 中文描述： | Cree公司的LED㈢EZ700⑩ |
| 文件頁數(shù)： | 2/6頁 |
| 文件大?。?/td> | 327K |
| 代理商： | CXXXEZ700-SXX000 |
Copyright 2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and EZBright, EZ, and EZ700 are trademarks of Cree, Inc.
CPR3DF Rev. A
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Maximum Ratings at T
A = 5°C
Note
CxxxEZ700-Sxx000
DC Forward Current
500 mA
Peak Forward Current
1000 mA Note 4
LED Junction Temperature
125°C
Reverse Voltage
5 V
Operating Temperature Range
-40°C to +100°C
Storage Temperature Range
-40°C to +120°C
Electrostatic Discharge Threshold Rating (HBM) Note 2
1000 V
Typical Electrical/Optical Characteristics at T
A = 5°C, If = 350 mA
Note 3
Part Number
Forward Voltage (V
f, V)
Reverse Current
[I(Vr=5 V), μA]
Full Width Half Max
(
λ
D, nm)
Min.
Typ.
Max.
Typ.
C450EZ700-Sxx000
3.0
3.6
3.9
2
21
C460EZ700-Sxx000
3.0
3.6
3.9
2
21
C470EZ700-Sxx000
3.0
3.6
3.9
2
22
Mechanical Specifications
CxxxEZ700-Sxx000
Description
Dimension
Tolerance
P-N Junction Area (μm)
650 x 650
±25
Chip Area (μm)
680 x 680
±25
Chip Thickness (μm)
100
±25
Top Au Bond Pad (μm)
130 x 130
±15
Au Bond Pad Thickness (μm)
3.0
±1.0
Back Contact Metal Area (μm)
680 x 680
±25
Back Contact Metal Thickness (μm)
3.0
±1.0
Notes:
Maximum ratings are package-dependent. The above ratings were determined using a Au-plated TO39 header without an
encapsulant for characterization. Ratings for other packages may differ. The junction temperature should be characterized in a
specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds). See Cree
EZBright Applications Note for assembly-process information.
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the minimum ESD ratings shown.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 350 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values
given are within the range of average expected by the manufacturer in large quantities and are provided for information only.
All measurements were made using a Au-plated TO39 header without an encapsulant. Optical characteristics measured in an
integrating sphere using Illuminance E.
This peak forward current specification is based on a 400 ms pulse width at a 1/5-duty cycle with a junction temperature of
65°C.
1.
2.
3.
4.
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