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參數(shù)資料
| 型號： | CY7C1362B |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | Plastic Connector Backshell; Enclosure Material:Plastic; Enclosure Color:Beige; Leaded Process Compatible:No; No. of Positions:26; Peak Reflow Compatible (260 C):No RoHS Compliant: No |
| 中文描述： | 9兆位（256 × 36/512K × 18）流水線的SRAM |
| 文件頁數(shù)： | 7/34頁 |
| 文件大小： | 895K |
| 代理商： | CY7C1362B |
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CY7C1360B
CY7C1362B
Document #: 38-05291 Rev. *C
Page 7 of 34
ADSP
84
84
A4
B9
Input-
Synchronous
Address Strobe from Processor, sampled on
the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device
are captured in the address registers. A
1
, A
0
are
also loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
85
85
B4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on the
rising edge of CLK, active LOW
. When asserted
LOW, addresses presented to the device are
captured in the address registers. A
1
, A
0
are also
loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ZZ
64
64
T7
H11
Input-
Asynchro-
nous
ZZ “Sleep” Input, active HIGH
. When asserted
HIGH places the device in a non-time-critical
“sleep” condition with data integrity preserved. For
normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQs,
DQPs
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,7,
8,9,12,13,1
8,19,22,
23,24,25,
28,29,51,
80,1,30
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,7,
8,9,12,13,1
8,19,22,
23,24,25,
28,29,51,
80,1,30
K6,L6,
M6,N6,
K7,L7,
N7,P7,
E6,F6,
G6,H6,
D7,E7,
G7,H7,
D1,E1,
G1,H1,
E2,F2,
G2,H2,
K1,L1,
N1,P1,
K2,L2,
M2,N2,
P6,D6,
D2,P2
M11,L11,
K11,J11,
J10,K10,
L10,M10,
D10,E10,
F10,G10,
D11,E11,
F11,G11,
D1,E1,F1,
G1,D2,E2,
F2,G2,J1,
K1,L1,M1,
J2,K2,L2,
M2,N11,
C11,C1,N1
I/O-
Synchronous
Bidirectional Data I/O lines
. As inputs, they feed
into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data
contained in the memory location specified by the
addresses presented during the previous clock rise
of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the
pins behave as outputs. When HIGH, DQs and
DQP
X
are placed in a three-state condition.
V
DD
15,41,65,
91
15,41,65,
91
J2,C4,J4,
R4,J6
D4,D8,E4,
E8,F4,F8,
G4,G8,H4,
H8,J4,J8,
K4,K8,L4,
L8,M4,M8
Power Supply
Power supply inputs to the core of the device
.
V
SS
17,40,67,
90
17,40,67,
90
D3,E3,
F3,H3,
K3,M3,
N3,P3,
D5,E5,
F5,H5,
K5,M5,
N5,P5
C4,C5,C6,
C7,C8,D5,
D6,D7,E5,
E6,E7,F5,
F6,F7,G5,
G6,G7,H2,
H5,H6,H7,J
5,J6,J7,
K5,K6,K7,
L5,L6,L7,
M5,M6,M7,
N4,N8
Ground
Ground for the core of the device
.
CY7C1360B–Pin Definitions
(continued)
Name
TQFP
3-Chip
Enable
TQFP
2-Chip
Enable
BGA
fBGA
I/O
Description
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| CY7C1362B-166AJC | 功能描述:IC SRAM 9MBIT 166MHZ 100LQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 |
| CY7C1362B-166BGC | 功能描述:IC SRAM 9MBIT 166MHZ 119BGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 |
| CY7C1362B-200AC | 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Single 3.3V 9M-Bit 512K x 18 3ns 100-Pin TQFP |
| CY7C1362C-166AJXC | 功能描述:靜態(tài)隨機存取存儲器 512Kx18 3.3V COM Sync PL 1CD 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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