參數(shù)資料
型號(hào)： CY7C1381C-117BZI
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
中文描述： 512K X 36 STANDARD SRAM, 7.5 ns, PBGA165
封裝： 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
文件頁(yè)數(shù)： 33/36頁(yè)
文件大?。?/td> 564K
代理商： CY7C1381C-117BZI
CY7C1381C
CY7C1383C
Document #: 38-05238 Rev. *B
Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Page 33 of 36
100
CY7C1381C-100AC
CY7C1383C-100AC
CY7C1381C-100BGC
CY7C1383C-100BGC
CY7C1381C-100BZC
CY7C1383C-100BZC
CY7C1381C-100AI
CY7C1383C-100AI
CY7C1381C-100BGI
CY7C1383C-100BGI
CY7C1381C-100BZI
CY7C1383C-100BZI
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
Commercial
BG119
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
Industrial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 3 Chip Enables and
JTAG
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
Package Diagrams
Ordering Information
Speed
(MHz)
Ordering Code
Package
Name
Part and Package Type
Operating
Range
DIMENSIONS ARE IN MILLIMETERS.
0.30±0.08
0.65
TYP.
2
2
1.40±0.05
12°±1°
(8X)
1.60 MAX.
0.05 MIN.
0.15 MAX.
0.60±0.15
0° MIN.
0.25
0°-7°
STAND-OFF
R 0.08 MIN.
0.20 MAX.
0.20 MAX.
R 0.08 MIN.
0.20 MAX.
14.00±0.10
16.00±0.20
0
SEE DETAIL
A
DETAIL
A
1
100
30
31
50
51
80
81
GAUGE PLANE
1.00 REF.
0.20 MIN.
SEATING PLANE
100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
51-85050-*A
相關(guān)PDF資料
PDF描述
CY7C1381C-133AC 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
CY7C1381C-133BGC 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
CY7C1381C-133BZC 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383C 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
CY7C1383C-100AC 18-Mb (512K x 36/1M x 18) Flow-Through SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1381D-100AXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V COM Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381D-100AXCKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1381D-100AXCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V COM Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381D-100BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V COM Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1381D-100BZI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V IND Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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