INTEGRATED CIRCUITS D
參數(shù)資料
型號(hào): CYG2217
廠商: IXYS Integrated Circuits Division
文件頁數(shù): 4/4頁
文件大?。?/td> 0K
描述: IC MOD PHONE LINE WIRE 1.07" PCB
標(biāo)準(zhǔn)包裝: 18
系列: Cybergate™
功能: 數(shù)據(jù)存取裝置(DAA)
電路數(shù): 1
電源電壓: 5V
電流 - 電源: 5mA
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 18-DIP 模塊(0.850",21.59mm)9 引線
供應(yīng)商設(shè)備封裝: 18-DIP
包裝: 管件
包括: 電子電感器和回轉(zhuǎn)器,低功率摘機(jī)或掛機(jī)開關(guān),振鈴檢測(cè)器,電涌保護(hù)
INTEGRATED CIRCUITS DIVISION
R02
www.ixysic.com
4
CYG2217
2
Manufacturing Information
2.1 Handling and Assembly Recommendations
The CYG2217 is not hermetically sealed, and should not be exposed to any liquid-based rinsing processes. IXYS
Integrated Circuits Division recommends two (2) approaches: (1) the modem should be installed in a wave-soldering
process that uses a no-clean soldering flux that will mostly evaporate during the normal wave-soldering processes,
(2) the modem should be soldered in by hand after the rest of the card is wave-soldered.
2.2 Reflow Profile
This product has a maximum solder temperature as shown below.
2.3 Mechanical Dimensions
2.3.1 CYG2217
Device
Maximum Temperature
CYG2217
260°C
XMIT+
OH
RI
GND
+V
CC
RING
TIP
27.18
(1.070)
27.18
(1.070)
10.16
(0.400)
0.634 SQ.
(0.025)
TYP.
SIDE VIEW
TOP VIEW
3.18
(0.125)
2.54
(0.100)
21.59
(0.850)
PCB Pattern
(Top View)
1.91
(0.075)
3.43
(0.135)
1.09 DIA.
(0.043)
TYP.
Dimensions
mm
(inches)
NC
RCV
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CYG2217-R02
Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
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