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參數(shù)資料
| 型號： | D2304G |
| 英文描述： | 1.3 mm D2300-Type Laser Isolated DFB Laser Module |
| 中文描述： | 1.3毫米D2300型激光隔離DFB激光器模塊 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 265K |
| 代理商： | D2304G |
2
Lucent Technologies Inc.
Data Sheet
February 2000
Isolated DFB Laser Module
1.3
m D2300-Type Digital
Description
The D2300-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, distributed-
feedback (DFB) laser designed for 1.3
m applications.
The laser is designed to be used in OC-12/STM-4 (622
Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long-
reach and extended-reach applications.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard.
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, ber-optic
systems. Light reected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25
°C for case temperatures from –40 °C to +80 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the ber. Normally, this conguration is
used in a feedback arrangement to maintain the aver-
age laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic buttery package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25
impedance. The laser module is equipped with a sin-
gle-mode ber. The pigtail has an 8
m core and
125
m cladding with a 900 m tight buffer coating.
Lucent Technologies Microelectronics Group optoelec-
tronic components are qualied to rigorous internal
standards that are consistent with
Telcordia Technolo-
gies TR-NWT-000468. All design and manufacturing
operations are
ISO * 9001 certied. The module is fully
qualied for central ofce applications.
*
ISO is a registered trademark of The International Organization for
Standardization.
Pin Information
* A positive current through the thermoelectric heat pump cools the
laser.
Both leads should be grounded for optimum performance.
Top view.
Figure 1. Circuit Schematic
Pin
Name
1
Thermistor
2
Thermistor
3
Laser dc Bias (cathode) (–)
4
Back-facet Monitor Anode (–)
5
Back-facet Monitor Cathode (+)
6
Thermoelectric Cooler (+)*
7
Thermoelectric Cooler (–)*
8
Case Ground
9
Case Ground
10
Case Ground
11
Laser Anode (+)
12
RF Laser Input Cathode (–)
13
Laser Anode (+)
14
Case Ground
1-567
TEC
L1
160 nH
ISOLATOR
R1
20
PACKAGE
GROUNDS
–+
+
–
+–
+
76
5
4
3
2
1
8
9
10
11
12
13
TH
10 k
14
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