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參數(shù)資料
| 型號： | D2500 |
| 英文描述： | 1.5 m m D2500-Type Digital Isolated DFB Laser Module |
| 中文描述： | 1.5毫米D2500型數(shù)字隔離DFB激光器模塊 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 267K |
| 代理商： | D2500 |
2
Lucent Technologies Inc.
Data Sheet
February 2000
Isolated DFB Laser Module
1.5
m D2500-Type Digital
Description
The D2500-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, MQW, distrib-
uted-feedback (DFB) laser designed for 1.5
m appli-
cations. The laser is designed to be used in OC-12/
STM-4 (622 Mbits/s) and OC-48/STM-16 (2.488 Gbits/
s) for long-reach and extended-reach applications. It is
also capable of low dispersion penalties (<2 dB) for use
with ber spans exceeding 170 km (3000 ps/nm).
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard. To eliminate the need for optical ampliers in
some applications, the module can also be ordered
with higher output powers.
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, ber-optic
systems. Light reected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25
°C for case temperatures from –40 °C to +70 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the ber. Normally, this conguration is
used in a feedback arrangement to maintain the aver-
age laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic buttery package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25
impedance. The laser module is equipped with a sin-
gle-mode ber with an 8
m core and 125 m cladding.
The minimum pigtail length is 39.4 in. (100 cm); the
minimum bend radius is 1.18 in. (30 mm).
The pigtail is a 900
m tight buffer ber. Various con-
nector and pigtail options are available.
Lucent Technologies Microelectronics Group optoelec-
tric components are qualied to rigorous internal stan-
dards that are consistent with
Telcordia Technologies
TR-NWT-000468. All design and manufacturing opera-
tions are
ISO * 9001 certied. The module is fully quali-
ed for central ofce applications.
*
ISO is a registered trademark of The International Organization for
Standardization.
Pin Information
* A positive current through the thermoelectric heat pump cools the
laser.
Both leads should be grounded for optimum performance.
Top view.
Figure 1. Circuit Schematic
Pin
Name
1
Thermistor
2
Thermistor
3
Laser dc Bias (cathode) (–)
4
Back-facet Monitor Anode (–)
5
Back-facet Monitor Cathode (+)
6
Thermoelectric Cooler (+)*
7
Thermoelectric Cooler (–)*
8
Case Ground
9
Case Ground
10
Case Ground
11
Laser Anode (+)
12
RF Laser Input Cathode (–)
13
Laser Anode (+)
14
Case Ground
1-567
TEC
L1
160 nH
ISOLATOR
R1
20
PACKAGE
GROUNDS
–+
+
–
+–
+
76
5
4
3
2
1
8
9
10
11
12
13
TH
10 k
14
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