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參數(shù)資料
| 型號(hào)： | D370-10F |
| 英文描述： | D370-Type Digital Uncooled Laser Module |
| 中文描述： | D370型數(shù)碼致冷激光模組 |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大?。?/td> | 53K |
| 代理商： | D370-10F |
Data Sheet
D370-Type Digital Uncooled Laser Module
October 2000
2
Agere Sysems Inc.
Description (continued)
The device characteristics listed in this document are
met at 1.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a xed pho-
todiode current, the change in optical output is typically
±0.5 dB over an operating temperature range of –40 °C
to +85
°C.
This device incorporates the new laser 2000 manufac-
turing process from the Optoelectronic Products unit of
Agere Systems Inc. Laser 2000 is a low-cost platform
that targets high-volume manufacturing and tight prod-
uct distributions on all optical subassemblies. This plat-
form incorporates an advanced optical design that is
produced on Agere Systems’ highly automated produc-
tion lines. The laser 2000 platform is qualied for the
central ofce and uncontrolled environments, and can
be used for applications requiring high performance
and low cost.
Table 1. Pin Descriptions
Pin Number
Connection
1
NC/reserved
2
Case ground
3
NC/reserved
4
Photodiode cathode
5
Photodiode anode
6
Laser diode cathode
7
Laser diode anode
8
NC/reserved
Figure 1. D370-Type Digital Uncooled Laser Module Schematic, Top View
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Rating varies with temperature.
Parameter
Symbol
Min
Max
Unit
Maximum Peak Laser Drive Current or
Maximum Fiber Power *
IOP
PMAX
—
150
10
mA
mW
Peak Reverse Laser Voltage:
Laser
Monitor
VRL
VRD
—
2
20
V
Monitor Forward Current
IFD
—2
mA
Operating Case Temperature Range
TC
–40
85
°C
Storage Case Temperature Range
Tstg
–40
85
°C
Lead Soldering Temperature/Time
—
260/10
°C/s
Relative Humidity (noncondensing)
RH
—
85
%
1-900
56
8
7
43
1
2
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