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參數(shù)資料
| 型號(hào)： | D374 |
| 英文描述： | D374-Type Digital Uncooled 2.5 Gbits/s Laser Module |
| 中文描述： | D374型數(shù)碼制冷2.5 Gb /秒激光模組 |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大?。?/td> | 56K |
| 代理商： | D374 |
Data Sheet
December 2000
D374-Type Digital Uncooled 2.5 Gbits/s Laser Module
2
Agere Systems Inc.
Description
(continued)
The device characteristics listed in this document are
met at 1.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a fixed pho-
todiode current, the change in optical output is typically
±
0.5 dB over an operating temperature range of –40
to +85
°
C.
°
C
This device incorporates the new Laser 2000 manufac-
turing process developed by the Optoelectronic unit of
Agere Systems Inc. Laser 2000 is a low-cost platform
that targets high-volume manufacturing and tight prod-
uct distributions on all optical subassemblies. This plat-
form incorporates an advanced optical design that is
produced on a highly automated production line. The
Laser 2000 platform is qualified for the central office
and uncontrolled environments, and can be used for
applications requiring high performance and low cost.
Table 1. Pin Descriptions
Pin Number
1
2
3
4
5
6
7
8
Connection
NC/reserved
Case ground
NC/reserved
PD cathode
PD anode
Laser diode anode (+)
Laser RF input cathode (–), 25
Laser diode anode (+)
Figure 1. D374-Type Digital Uncooled 2.5 Gbits/s Laser Module Schematic, Top View
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Rating varies with temperature.
Parameter
Symbol
I
OP
P
MAX
Min
—
—
Max
150
10
Unit
mA
mW
Maximum Peak Laser Drive Current or
Maximum Fiber Power*
Peak Reverse Laser Voltage:
Laser
Monitor
Monitor Forward Current
Operating Case Temperature Range
Storage Case Temperature Range
Lead Soldering Temperature/Time
Relative Humidity (noncondensing)
V
V
I
T
T
—
RH
RL
RD
—
—
—
–40
–40
—
—
2
20
2
85
85
V
V
FD
mA
°
C
°
C
°
C/s
%
C
stg
260/10
85
5
6
8
7
4
3
1
2
1-900
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