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參數(shù)資料
| 型號： | D572-22FS |
| 英文描述： | D572-Type 1.5 m m Uncooled DFB FastLight ⑩ Laser Module for 2.5 Gbits/s and High Bandwidth Applications |
| 中文描述： | D572型1.5毫米致冷激光器FastLight⑩激光模塊的2.5 Gb /秒和高帶寬應(yīng)用 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 370K |
| 代理商： | D572-22FS |
D572-Type 1.5
for 2.5 Gbits/s and High-Bandwidth Applications
μ
m Uncooled DFB
FastLight
Laser Module
Advance Data Sheet
February 2000
2
Lucent Technologies Inc.
Description
(continued)
The device characteristics listed in this document are
met at 2.0 mW output power. Higher- or lower-power
operation is possible. Under conditions of a fixed
photodiode current, the change in optical output is typi-
cally
±
0.5 dB over an operating temperature range of
–25
°
C to +70
°
C.
This device incorporates the new Laser 2000 manufac-
turing process from the Optoelectronic Products unit of
Lucent Technologies Microelectronics Group. Laser
2000 is a low-cost platform that targets high-volume
manufacturing and tighter product distributions on all
optical subassemblies. This platform incorporates an
advanced optical design that is produced on one of the
highly automated production lines at the Opotelectronic
manufacturing facility. The Laser 2000 platform is quali-
fied for the central office and uncontrolled environ-
ments, and can be used for applications requiring high
performance and low cost.
Table 1. Pin Descriptions
Pin Number
1
2
3
4
5
6
7
8
Connection
Thermistor
Thermistor, package GND
Laser dc bias cathode (–) choke
Photodiode cathode
Photodiode anode
Laser diode anode (+)
Laser RF input cathode (–) 25
Laser diode anode (+)
Figure 1. D572-Type Uncooled DFB Mini 8-Pin Laser Module Schematic, Top View
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Rating varies with temperature.
Parameter
Symbol
I
OP
P
MAX
Min
—
—
Max
150
10
Unit
mA
mW
Maximum Peak Laser Drive Current or
Maximum Fiber Power*
Peak Reverse Laser Voltage:
Laser
Monitor
Monitor Forward Current
Operating Case Temperature Range
Storage Case Temperature Range
Lead Soldering Temperature/Time
Relative Humidity (noncondensing)
V
V
I
T
T
—
RH
RL
RM
—
—
—
–40
–40
—
—
2
20
2
85
85
V
V
FD
mA
°
C
°
C
°
C/s
%
C
stg
260/10
85
1-900.b
5
6
8
7
4
3
1
2
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