參數(shù)資料
型號(hào)： DAC5571EVM
廠商： Texas Instruments, Inc.
英文描述： DAC5571 Evaluation Module(DAC5571評(píng)估模塊)
中文描述： DAC5571評(píng)估模塊（DAC5571評(píng)估模塊）
文件頁(yè)數(shù)： 16/39頁(yè)
文件大?。?/td> 437K
代理商： DAC5571EVM
PCB Layout
2-2
2.1
PCB Layout
The DAC EVM demonstrates the high performance of the DAC under test
conditions specified in the datasheet by implementing design practices that
preserve DAC performance. Careful analysis of these practices is the key to
a successful design implementation. Many of the practices affect the
schematic design phase, including correct component selection, adequate
bypassing, separating and managing analog and digital signals, and
understanding component mechanical attributes.
The circuit layout is critical in any high-performance analog circuit, and DAC
circuit design is no exception. Component placement and signal routing are
important considerations. Place bypass capacitors as close as possible to the
pins, with analog and digital signals properly separated from each other.
The power and ground planes are very important and must be carefully
designed. A solid plane is best, but when solid planes are not possible, a split
plane is usually adequate. When considering a split plane design, analyze the
component placement and carefully divide the board into its analog and digital
sections starting from the device under test. The ground plane plays an
important role in controlling the noise and other effects that contribute to DAC
output errors. To ensure that return currents are handled properly, route the
signals only in their respective sections; analog traces must only lie directly
above or below the analog section and digital traces in the digital section.
Minimize the length of the traces but use the widest allowable trace in the
design. The EVM layout incorporates these design practices and are shown
in the illustrations presented below.
This DAC EVM board is constructed on a four-layer printed circuit board using
a copper-clad FR-4 laminate material. The printed circuit board dimensions
are 43,1800 mm (1.7000 inch)
×
82,5500 mm (3.2500 inch), and the board
thickness is 1,5748 mm (0.0620 inch). Figure 2-1 through Figure 2-7 shows
the artwork for the individual layers.
Figure 2-1. Top Silkscreen
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DAC5571IDBVR 功能描述:數(shù)模轉(zhuǎn)換器- DAC Low-power 8-Bit w/hi-speed I2C Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC5571IDBVRG4 功能描述:數(shù)模轉(zhuǎn)換器- DAC Low-power 8-Bit w/hi-speed I2C Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC5571IDBVT 功能描述:數(shù)模轉(zhuǎn)換器- DAC Low-power 8-Bit w/hi-speed I2C Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC5571IDBVTG4 功能描述:數(shù)模轉(zhuǎn)換器- DAC Low-power 8-Bit w/hi-speed I2C Input RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC5573 制造商:TI 制造商全稱:Texas Instruments 功能描述:QUAD, 8-BIT, LOW-POWER, VOLTAGE OUTPUT, INTERFACE DIGITAL-TO-ANALOG CONVERTER
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