DAC7512
4
SBAS156
PIN
NAME
DESCRIPTION
1VOUT
Analog output voltage from DAC. The output ampli-
fier has rail-to-rail operation.
2
GND
Ground reference point for all circuitry on the part.
3VDD
Power Supply Input, +2.7V to 5.5V.
4DIN
Serial Data Input. Data is clocked into the 16-bit
input shift register on the falling edge of the serial
clock input.
5
SCLK
Serial Clock Input. Data can be transferred at rates
up to 30MHz.
6
SYNC
Level triggered control input (active LOW). This is
the frame sychronization signal for the input data.
When SYNC goes LOW, it enables the input shift
register and data is transferred in on the falling
edges of the following clocks. The D/A is updated
following the 16th clock cycle unless SYNC is taken
HIGH before this edge in which case the rising edge
of SYNC acts as an interrupt and the write se-
quence is ignored by the DAC7512.
PIN DESCRIPTION (SOT23-6)
VDD to GND ........................................................................... –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +VDD + 0.3V
VOUT to GND .......................................................... –0.3V to +VDD + 0.3V
Operating Temperature Range ...................................... –40
°C to +105°C
Storage Temperature Range ......................................... –65
°C to +150°C
Junction Temperature Range (TJ max) ........................................ +150°C
SOT23 Package:
Power Dissipation .................................................. (TJ max — TA)/θJA
θ
JA Thermal Impedance ......................................................... 240°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215
°C
Infrared (15s) ........................................................................ +220
°C
MSOP Package:
Power Dissipation ........................................................ (TJ max — TA)/θJA
θ
JA Thermal Impedance ......................................................... 206°C/W
θ
JC Thermal Impedance .......................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215
°C
Infrared (15s) ........................................................................ +220
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATIONS
Top View
SOT23-6
MSOP-8
V
DD
NC
V
OUT
GND
D
IN
SCLK
SYNC
1
2
3
4
8
7
6
5
DAC7512
NC = No Internal Connection
V
OUT
GND
V
DD
SYNC
SCLK
D
IN
1
2
3
6
5
4
DAC7512
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE
DIFFERENTIAL
PACKAGE
SPECIFICATION
ACCURACY
NONLINEARITY
DRAWING
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
(LSB)
PACKAGE
NUMBER
RANGE
MARKING
NUMBER(1)
MEDIA
DAC7512E
±8
±1
MSOP-8
337
–40
°C to +105°C
D12E
DAC7512E/250
Tape and Reel
""
"
DAC7512E/2K5
Tape and Reel
DAC7512N
±8
±1
SOT23-6
332
–40
°C to +105°C
D12N
DAC7512N/250
Tape and Reel
""
"
DAC7512N/3K
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “DAC7512E/2K5” will get a single 2500-piece Tape and Reel.