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參數(shù)資料
| 型號： | DAC8413FPC |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | DAC |
| 英文描述： | Quad, 12-Bit DAC Voltage Output with Readback |
| 中文描述： | QUAD, PARALLEL, WORD INPUT LOADING, 10 us SETTLING TIME, 12-BIT DAC, PQCC28 |
| 封裝： | PLASTIC, MO-047AB, LCC-28 |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 443K |
| 代理商： | DAC8413FPC |
DAC8412/DAC8413
–5–
REV. D
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
(
T
A
= +25
°
C unless otherwise noted)
V
SS
to V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
V
SS
to V
LOGIC
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +33.0 V
V
LOGIC
to DGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V
V
SS
to V
REFL
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +V
SS
–2.0 V
V
REFH
to V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, +33.0 V
V
REFH
to V
REFL
. . . . . . . . . . . . . . . . . . . . . . . . +2.0 V, V
SS
–V
DD
Current into Any Pin 4 . . . . . . . . . . . . . . . . . . . . . . . .
±
15 mA
Digital Input Voltage to DGND . . . . . –0.3 V, V
LOGIC
+0.3 V
Digital Output Voltage to DGND . . . . . . . . . . –0.3 V, +7.0 V
Operating Temperature Range
ET, FT, EP, FP, FPC . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
AT, BT, BTC . . . . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150
°
C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Power Dissipation Package . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°
C
CAUTION
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only; functional operation at or above this specification is not implied.
Exposure to the above maximum rating conditions for extended periods may affect
device reliability.
2. Digital inputs and outputs are protected, however, permanent damage may occur on unprotected units
from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until
ready to use. Use proper antistatic handling procedures.
3. Remove power before inserting or removing units from their sockets.
4. Analog outputs are protected from short circuit to ground or either supply.
Thermal Resistance
Package Type
JA
*
48
JC
Units
22
°
C/W
28
°
C/W
25
°
C/W
28-Lead Plastic DIP (P)
28-Lead Hermetic Leadless Chip Carrier (TC) 70
28-Lead Plastic Leaded Chip Carrier (PC)
63
*
θ
is specified for worst-case mounting conditions, i. e.,
θ
JA
is specified for device
in socket.
ORDERING INFORMATION
1, 2
INL
(LSB)
±
1
±
1.5
0.5
±
1
±
1
±
1.5
±
0.5
±
1
Military
3
Temperature
–55 C to +125 C
Extended Industrial
3
Temperature
–40 C to +85 C
Package
Description
Package
Option
DAC8412FPC
PLCC
LCC
Plastic DIP
Plastic DIP
PLCC
LCC
Plastic DIP
Plastic DIP
P-28A
E-28A
N-28
N-28
P-28A
E-28A
N-28
N-28
DAC8412BTC/883
DAC8412EP
DAC8412FP
DAC8413FPC
DAC8413BTC/883
DAC8413EP
DAC8413FP
NOTES
1
Die Size 0.225
×
0.165 inches, 37,125 sq. mils (5.715
×
4.191 mm, 23.95 sq. mm). Substrate should be connected to V
DD
; Transistor Count = 2595.
2
Burn-in is available on extended industrial temperature range parts in cerdip.
3
A complete /883 data sheet is available. For availability and burn-in information, contact your local sales office.
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