
DAC8531
2
SBAS192B
www.ti.com
VDD to GND ........................................................................... –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +VDD + 0.3V
VOUT to GND .......................................................... –0.3V to +VDD + 0.3V
Operating Temperature Range ...................................... –40
°C to +105°C
Storage Temperature Range ......................................... –65
°C to +150°C
Junction Temperature Range (TJ max) ........................................ +150°C
Power Dissipation ........................................................ (TJ max — TA)/θJA
θ
JA Thermal Impedance ......................................................... 206°C/W
θ
JC Thermal Impedance .......................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215
°C
Infrared (15s) ........................................................................ +220
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS(1)
PACKAGE/ORDERING INFORMATION
MINIMUM
RELATIVE
DIFFERENTIAL
SPECIFICATION
ACCURACY
NONLINEARITY
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
(LSB)
PACKAGE-LEAD
DESIGNATOR(1)
RANGE
MARKING
NUMBER
MEDIA, QUANTITY
DAC8531E
±64
±1
MSOP-8
DGK
–40
°C to +105°C
D31
DAC8531E/250
Tape and Reel, 250
""
"
DAC8531E/ 2K5
Tape and Reel, 2500
DAC8531I
±64
±1
SON-8
DRB
–40
°C to +105°C
D31
DAC8531IDRBT
Tape and Reel, 250
DAC8531I
""
"
""
DAC8531IDRBR
Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE (1)
Resolution
16
Bits
Relative Accuracy
±0.098
% of FSR
Differential Nonlinearity
Ensured Monotonic by Design
±1LSB
Zero Code Error
All Zeroes Loaded to DAC Register
+5
+20
mV
Full-Scale Error
All Ones Loaded to DAC Register
–0.15
–1.25
% of FSR
Gain Error
±1.25
% of FSR
Zero Code Error Drift
±20
V/°C
Gain Temperature Coefficient
±5
ppm of FSR/
°C
OUTPUT CHARACTERISTICS (2)
Output Voltage Range
0V
REF
V
Output Voltage Settling Time
To
±0.003% FSR
0200
H to FD00H
810
s
R
L = 2k; 0pF < CL < 200pF
R
L = 2k; CL = 500pF
12
s
Slew Rate
1V/
s
Capacitive Load Stability
R
L = ∞
470
pF
R
L = 2k
1000
pF
Code Change Glitch Impulse
1LSB Change Around Major Carry
20
nV-s
Digital Feedthrough
0.5
nV-s
DC Output Impedance
1
Short-Circuit Current
V
DD = +5V
50
mA
V
DD = +3V
20
mA
Power-Up Time
Coming Out of Power-Down Mode
V
DD = +5V
2.5
s
Coming Out of Power-Down Mode
V
DD = +3V
5
s
REFERENCE INPUT
Reference Current
V
REF = VDD = +5V
35
45
A
V
REF = VDD = +3.6V
20
30
A
Reference Input Range
0
V
DD
V
Reference Input Impedance
150
k
ELECTRICAL CHARACTERISTICS
V
DD = +2.7V to +5.5V. –40°C to +105°C, unless otherwise specified.
DAC8531E
NOTES: (1) Linearity calculated using a reduced code range of 485 to 64714; output unloaded. (2) Ensured by design and characterization, not production tested.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.