參數(shù)資料
型號(hào)： DAC8832IBRGY
廠商： Texas Instruments, Inc.
英文描述： 16-Bit, Ultra-Low Power, Voltage-Output Digital-to-Analog Converter
中文描述： 16位，超低功耗，電壓輸出數(shù)字模擬轉(zhuǎn)換器
文件頁數(shù)： 21/26頁
文件大?。?/td> 702K
代理商： DAC8832IBRGY
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
QFN
Package
Drawing
RGY
Pins Package
Qty
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
DAC8832IBRGYR
ACTIVE
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IBRGYRG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IBRGYT
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IBRGYTG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832ICRGYR
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832ICRGYRG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832ICRGYT
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832ICRGYTG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IRGYR
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IRGYRG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IRGYT
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
DAC8832IRGYTG4
ACTIVE
QFN
RGY
14
CU NIPDAU
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Addendum-Page 1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DAC8832IBRGYR 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16B Ultra-Lo Pwr Vltg Output DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC8832IBRGYRG4 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16B Ultra-Lo Pwr Vltg Output DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC8832IBRGYT 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16B Ultra-Lo Pwr Vltg Output DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC8832IBRGYTG4 功能描述:數(shù)模轉(zhuǎn)換器- DAC 16B Ultra-Lo Pwr Vltg Output DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
DAC8832ICRGY 制造商:TI 制造商全稱:Texas Instruments 功能描述:16-Bit, Ultra-Low Power, Voltage-Output Digital-to-Analog Converter
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