型號 | 廠商 | 描述 |
1n5999b 2 3 4 5 6 7 8 |
ON SEMICONDUCTOR | 500 mW DO-35 Glass Zener Voltage Regulator Diode(500 mW DO-35玻璃封裝,9.1V齊納電壓,齊納穩(wěn)壓二極管) |
1n5985b 2 3 4 5 6 7 8 |
MOTOROLA INC | 500mW DO-35 Glass Zener Voltage Regulator Diode(500mW,電壓工作范圍1.8-200V的DO-35封裝齊納穩(wěn)壓二極管) |
1n6000 2 3 |
MICROSEMI CORP-SCOTTSDALE | Anti-Static Storage Bags; External Height:125ft; External Width:24" RoHS Compliant: NA |
1n6000a 2 3 |
MICROSEMI CORP-LAWRENCE | Anti-Static Storage Bags; External Height:125ft; External Width:48" RoHS Compliant: NA |
1n6008a 2 3 |
MICROSEMI CORP-SCOTTSDALE | Insulating Tape; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6009a 2 3 |
MICROSEMI CORP-SCOTTSDALE | Insulating Tape; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6026a 2 3 |
MICROSEMI CORP-SCOTTSDALE | Sealing Tape; Tape Backing Material:Rubber; Width:0.75"; Roll Length:15ft; Color:Black RoHS Compliant: Yes |
1n6028a 2 3 |
MICROSEMI CORP-LAWRENCE | SIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6029a 2 3 |
MICROSEMI CORP-SCOTTSDALE | Static Protection Wrist Grounder; Body Material:Fabric RoHS Compliant: NA |
1n5985a 2 3 |
MICROSEMI CORP-LAWRENCE | surface mount silicon Zener diodes |
1n6026 2 3 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250 ,Low Reverse Leakage,Low Noise Zener Diode |
1n5997a 2 3 |
MICROSEMI CORP-SCOTTSDALE | surface mount silicon Zener diodes |
1n5998a 2 3 |
MICROSEMI CORP-LAWRENCE | surface mount silicon Zener diodes |
1n5999a 2 3 |
MICROSEMI CORP-SCOTTSDALE | surface mount silicon Zener diodes |
1n5997 2 3 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·¥?????μ?μ?????°????????????μ?μ?????????a?£°???é???o3?o???????) |
1n6018a 2 3 |
MICROSEMI CORP-LAWRENCE | surface mount silicon Zener diodes |
1n6019a 2 3 |
MICROSEMI CORP-SCOTTSDALE | surface mount silicon Zener diodes |
1n6018 2 3 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·¥?????μ?μ?????°????????????μ?μ?????????a?£°???é???o3?o???????) |
1n6001 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6001a 2 3 |
MICROSEMI CORP-LAWRENCE | DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6002 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6002a 2 3 |
MICROSEMI CORP-SCOTTSDALE | IC Socket; Leaded Process Compatible:Yes; No. of Contacts:14; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.15"; Terminal Type:PC Board RoHS Compliant: Yes |
1n6003 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6003a 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6004 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6004a 2 3 |
MICROSEMI CORP-SCOTTSDALE | SOCKET ECONO ZIP 16 POS GOLD |
1n6005 2 3 |
MICROSEMI CORP-SCOTTSDALE | IC Socket; Leaded Process Compatible:Yes; No. of Contacts:16; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes |
1n6005a 2 3 |
MICROSEMI CORP-SCOTTSDALE | IC Socket; Leaded Process Compatible:Yes; No. of Contacts:16; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.15"; Terminal Type:PC Board RoHS Compliant: Yes |
1n6006 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6006a 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6007 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6007a 2 3 |
MICROSEMI CORP-SCOTTSDALE | IC Socket; Leaded Process Compatible:Yes; No. of Contacts:18; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes |
1n6008 2 3 |
MICROSEMI CORP-SCOTTSDALE | 3/4X36YD PLASTIC TAPE |
1n6009 2 3 |
MICROSEMI CORP-SCOTTSDALE | Insulating Tape; Peak Reflow Compatible (260 C):No |
1n6010 2 3 |
MICROSEMI CORP-SCOTTSDALE | Insulating Tape; Peak Reflow Compatible (260 C):No |
1n6010a 2 3 |
MICROSEMI CORP-SCOTTSDALE | MASTIC PAD |
1n6011 2 3 |
MICROSEMI CORP-SCOTTSDALE | SIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6011a 2 3 |
MICROSEMI CORP-LAWRENCE | DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6012 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6012a 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6027 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6027a 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6028 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6029 2 3 |
MICROSEMI CORP-SCOTTSDALE | IC Socket; Leaded Process Compatible:Yes; No. of Contacts:24; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes |
1n6030 2 3 |
MICROSEMI CORP-SCOTTSDALE | Static Protection Wrist Grounder; Body Material:Fabric RoHS Compliant: NA |
1n6030a 2 3 |
MICROSEMI CORP-LAWRENCE | DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.4"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6031 2 3 |
MICROSEMI CORP-SCOTTSDALE | DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n6031a 2 3 |
MICROSEMI CORP-LAWRENCE | DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n5990 2 3 |
MICROSEMI CORP-SCOTTSDALE | Low Current Operation at 250 ,Low Reverse Leakage,Low Noise Zener Diode |
1n5990a 2 3 |
MICROSEMI CORP-LAWRENCE | surface mount silicon Zener diodes |