型號 廠商 描述
1n5999b
2 3 4 5 6 7 8
ON SEMICONDUCTOR 500 mW DO-35 Glass Zener Voltage Regulator Diode(500 mW DO-35玻璃封裝,9.1V齊納電壓,齊納穩(wěn)壓二極管)
1n5985b
2 3 4 5 6 7 8
MOTOROLA INC 500mW DO-35 Glass Zener Voltage Regulator Diode(500mW,電壓工作范圍1.8-200V的DO-35封裝齊納穩(wěn)壓二極管)
1n6000
2 3
MICROSEMI CORP-SCOTTSDALE Anti-Static Storage Bags; External Height:125ft; External Width:24" RoHS Compliant: NA
1n6000a
2 3
MICROSEMI CORP-LAWRENCE Anti-Static Storage Bags; External Height:125ft; External Width:48" RoHS Compliant: NA
1n6008a
2 3
MICROSEMI CORP-SCOTTSDALE Insulating Tape; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6009a
2 3
MICROSEMI CORP-SCOTTSDALE Insulating Tape; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6026a
2 3
MICROSEMI CORP-SCOTTSDALE Sealing Tape; Tape Backing Material:Rubber; Width:0.75"; Roll Length:15ft; Color:Black RoHS Compliant: Yes
1n6028a
2 3
MICROSEMI CORP-LAWRENCE SIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6029a
2 3
MICROSEMI CORP-SCOTTSDALE Static Protection Wrist Grounder; Body Material:Fabric RoHS Compliant: NA
1n5985a
2 3
MICROSEMI CORP-LAWRENCE surface mount silicon Zener diodes
1n6026
2 3
MICROSEMI CORP-SCOTTSDALE Low Current Operation at 250 ,Low Reverse Leakage,Low Noise Zener Diode
1n5997a
2 3
MICROSEMI CORP-SCOTTSDALE surface mount silicon Zener diodes
1n5998a
2 3
MICROSEMI CORP-LAWRENCE surface mount silicon Zener diodes
1n5999a
2 3
MICROSEMI CORP-SCOTTSDALE surface mount silicon Zener diodes
1n5997
2 3
MICROSEMI CORP-SCOTTSDALE Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·¥?????μ?μ?????°????????????μ?μ?????????a?£°???é???o3?o???????)
1n6018a
2 3
MICROSEMI CORP-LAWRENCE surface mount silicon Zener diodes
1n6019a
2 3
MICROSEMI CORP-SCOTTSDALE surface mount silicon Zener diodes
1n6018
2 3
MICROSEMI CORP-SCOTTSDALE Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?·¥?????μ?μ?????°????????????μ?μ?????????a?£°???é???o3?o???????)
1n6001
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6001a
2 3
MICROSEMI CORP-LAWRENCE DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6002
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:14; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6002a
2 3
MICROSEMI CORP-SCOTTSDALE IC Socket; Leaded Process Compatible:Yes; No. of Contacts:14; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.15"; Terminal Type:PC Board RoHS Compliant: Yes
1n6003
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6003a
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6004
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:16; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6004a
2 3
MICROSEMI CORP-SCOTTSDALE SOCKET ECONO ZIP 16 POS GOLD
1n6005
2 3
MICROSEMI CORP-SCOTTSDALE IC Socket; Leaded Process Compatible:Yes; No. of Contacts:16; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes
1n6005a
2 3
MICROSEMI CORP-SCOTTSDALE IC Socket; Leaded Process Compatible:Yes; No. of Contacts:16; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.15"; Terminal Type:PC Board RoHS Compliant: Yes
1n6006
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6006a
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6007
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:18; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6007a
2 3
MICROSEMI CORP-SCOTTSDALE IC Socket; Leaded Process Compatible:Yes; No. of Contacts:18; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes
1n6008
2 3
MICROSEMI CORP-SCOTTSDALE 3/4X36YD PLASTIC TAPE
1n6009
2 3
MICROSEMI CORP-SCOTTSDALE Insulating Tape; Peak Reflow Compatible (260 C):No
1n6010
2 3
MICROSEMI CORP-SCOTTSDALE Insulating Tape; Peak Reflow Compatible (260 C):No
1n6010a
2 3
MICROSEMI CORP-SCOTTSDALE MASTIC PAD
1n6011
2 3
MICROSEMI CORP-SCOTTSDALE SIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6011a
2 3
MICROSEMI CORP-LAWRENCE DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6012
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6012a
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:20; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6027
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6027a
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6028
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:24; Pitch Spacing:0.1"; Row Spacing:0.3"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6029
2 3
MICROSEMI CORP-SCOTTSDALE IC Socket; Leaded Process Compatible:Yes; No. of Contacts:24; Peak Reflow Compatible (260 C):No; Pitch Spacing:0.3"; Terminal Type:PC Board RoHS Compliant: Yes
1n6030
2 3
MICROSEMI CORP-SCOTTSDALE Static Protection Wrist Grounder; Body Material:Fabric RoHS Compliant: NA
1n6030a
2 3
MICROSEMI CORP-LAWRENCE DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.4"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6031
2 3
MICROSEMI CORP-SCOTTSDALE DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n6031a
2 3
MICROSEMI CORP-LAWRENCE DIP Socket; No. of Contacts:28; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
1n5990
2 3
MICROSEMI CORP-SCOTTSDALE Low Current Operation at 250 ,Low Reverse Leakage,Low Noise Zener Diode
1n5990a
2 3
MICROSEMI CORP-LAWRENCE surface mount silicon Zener diodes