型號 廠商 描述
fu-68sdf-v810m124b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m139b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m140b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m141b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate
fu-68sdf-v810m142b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m143b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m144b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m145b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m146b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m147b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 4700pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: P Failure Rate
fu-68sdf-v810m148b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m149b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m150b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m151b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m152b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m167b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 5600pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: R Failure Rate
fu-68sdf-v810m168b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m169b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m170b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m171b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m172b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m173b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 5600pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate
fu-68sdf-v810m174b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m175b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m176b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m177b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m178b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m179b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m180b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m103b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m104b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m105b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m106b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m107b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m108b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m109b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m110b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m125b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 270pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: S Failure Rate
fu-68sdf-v810m126b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m127b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m128b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m129b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m130b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m131b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m132b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: Sn60 Coated; Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: P Failure Rate
fu-68sdf-v810m133b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m134b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m135b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)
fu-68sdf-v810m136b
2 3 4 5
Mitsubishi Electric Corporation Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 1805; Termination: 100% Tin (Sn); Body Dimensions: 0.180" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: R Failure Rate
fu-68sdf-v810m137b
2 3 4 5
Mitsubishi Electric Corporation 1.58 um (L-Band) DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL (WAVELENGTH SELECTED, BIAS CIRCUIT INTEGRATED, DIGITAL APPLICATION)