參數(shù)資料
型號(hào)： DC1339A
廠商： Linear Technology
文件頁(yè)數(shù)： 11/20頁(yè)
文件大?。?/td> 0K
描述： BOARD SAR ADC LTC2302
軟件下載： QuikEval System
設(shè)計(jì)資源： DC1339A Design File
DC1339A Schematic
標(biāo)準(zhǔn)包裝： 1
系列： QuikEval™
ADC 的數(shù)量： 1
位數(shù)： 12
采樣率（每秒）： 500k
數(shù)據(jù)接口： MICROWIRE?，串行，SPI?
輸入范圍： ±VREF/2
在以下條件下的電源（標(biāo)準(zhǔn)）： 14mW @ 500kSPS
已用 IC / 零件： LTC2302
已供物品： 板
相關(guān)產(chǎn)品： LTC2302IDD#TRPBF-ND - IC ADC 12-BIT 1CH 500KSPS 10DFN
LTC2302IDD#PBF-ND - IC ADC 12BIT 1CH 500KSPS 10-DFN
LTC2302CDD#TRPBF-ND - IC ADC 12-BIT 1CH 500KSPS 10DFN
LTC2302CDD#PBF-ND - IC ADC 12BIT 1CH 500KSPS 10-DFN
LTC2302/LTC2306
19
23026fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
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