參數(shù)資料
型號： DC1370A-L
廠商： Linear Technology
文件頁數(shù)： 26/34頁
文件大?。?/td> 0K
描述： BOARD DEMO 25MSPS LTC2256-12
軟件下載： QuikEval II System
設(shè)計(jì)資源： DC1370A Design Files
標(biāo)準(zhǔn)包裝： 1
系列： *
相關(guān)產(chǎn)品： DC718C-ND - DEMO QUIKEVAL-II DATA
LTC2258-12
LTC2257-12/LTC2256-12
32
225812fd
For more information www.linear.com/LTC2258-12
package DescripTion
UJ Package
40-Lead Plastic QFN (6mm × 6mm)
(Reference LTC DWG # 05-08-1728 Rev )
6.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.45 OR
0.35
× 45°
CHAMFER
0.40 ± 0.10
40
39
1
2
BOTTOM VIEW—EXPOSED PAD
4.50 REF
(4-SIDES)
4.42 ±0.10
4.42 ±0.05
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UJ40) QFN REV 0406
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
4.50 ±0.05
(4 SIDES)
5.10 ±0.05
6.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
R = 0.10
TYP
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關(guān)PDF資料
PDF描述
KK3270045 OSCILLATOR 32.768 KHZ SMD
74 LAMP T 1-3/4
393 LAMP INCAND T1-3/4 MIDGE GROOVE
LC1ALG FLUORESCENT TASK LIGHT
398 LAMP INCAND T1-3/4 MIDGE GROOVE
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