參數(shù)資料
型號(hào): DC812A
廠商: Linear Technology
文件頁(yè)數(shù): 10/20頁(yè)
文件大小: 0K
描述: BOARD DAC LTC2606
軟件下載: QuikEval System
設(shè)計(jì)資源: DC812A Design File
DC812A Schematic
標(biāo)準(zhǔn)包裝: 1
系列: QuikEval™
DAC 的數(shù)量: 1
位數(shù): 16
數(shù)據(jù)接口: I²C
設(shè)置時(shí)間: 10µs
DAC 型: 電壓
工作溫度: 0°C ~ 70°C
已供物品:
已用 IC / 零件: LTC2606
相關(guān)產(chǎn)品: LTC2606CDD-1#PBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606IDD-1#PBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606IDD#PBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606CDD#PBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606IDD#TRPBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606IDD-1#TRPBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606CDD-1#TRPBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606CDD#TRPBF-ND - IC DAC 16BIT I2C V-OUT 10-DFN
LTC2606/LTC2616/LTC2626
18
26061626fb
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.125
TYP
2.38 0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV B 0309
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.70 0.05
3.55 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
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