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參數(shù)資料
| 型號(hào)： | DEMO1985MC34940E |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 6/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | KIT DEMO FOR MC34940E FAMILY |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 傳感器類型： | 觸摸，電容式 |
| 接口： | 模擬 |
| 電源電壓： | 9 V ~ 18 V |
| 嵌入式： | 否 |
| 已供物品： | 板 |
| 已用 IC / 零件： | MC34940 |
| 相關(guān)產(chǎn)品： | MC34940EGR2-ND - IC IMAGING DEVICE ELEC 24-SOICW MC34940EG-ND - IC IMAGING DEVICE ELECT 24-SOICW |
Sensors
Freescale Semiconductor
3
MC34940
Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (CZAP = 100 pF, RZAP = 1500 )
Machine Model (CZAP = 200 pF, RZAP = 0 )
Charge Device Model (CDM), Robotic (CZAP = 4.0 pF)
VESD
±2000
±200
±1200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-0 to 90
°C
Operating Junction Temperature
TJ
-0 to 150
°C
Thermal Resistance
Junction-to-Ambient (1)
Junction-to-Case (2)
Junction-to-Board (3)
RθJA
RθJC
RθJB
41
0.2
3.0
°C/W
Soldering Temperature (4)
TSOLDER
260
°C
Notes
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
2.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
3.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
4.
Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering.
Exceeding these limits may cause malfunction or permanent damage to the device.
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參數(shù)描述 |
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| DEMO-2006-MINI-DIST-KIT | 制造商:Baumer Electric Ag 功能描述: |
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| DEMO56F8013-EE | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F8013 BD W/UNIV PS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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