參數(shù)資料
型號: DF3048VF10V
廠商: Renesas Electronics America
文件頁數(shù): 44/46頁
文件大?。?/td> 0K
描述: MCU 3/5V 128K,PB-FREE 100-QFP
產(chǎn)品培訓(xùn)模塊: Electromagnetic Noise Reduction Techniques Part 1
Digital to Analog Converter Part 1
Digital to Analog Converter Part 2
標(biāo)準(zhǔn)包裝: 1
系列: H8® H8/300H
核心處理器: H8/300H
芯體尺寸: 16-位
速度: 10MHz
連通性: SCI,智能卡
外圍設(shè)備: DMA,PWM,WDT
輸入/輸出數(shù): 70
程序存儲器容量: 128KB(128K x 8)
程序存儲器類型: 閃存
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b; D/A 2x8b
振蕩器型: 內(nèi)部
工作溫度: -20°C ~ 75°C
封裝/外殼: 100-BFQFP
包裝: 托盤
The H8 Architecture
5
H8 MCUs: Faster
Execution Times
Besides maintaining compat-
ibility within the family,
H8 CPUs have been optimized
for high performance.
The majority of the instruc-
tions in the powerful CISC
instruction set will execute
in one clock cycle, giving
RISC-like operation.
Enhanced Hardware
for Performance
Enhanced
multipliers
and
dividers are included in the
CPU core to boost throughput
for mathematical operations
and
further
enhance
the
performance of the CPU cores.
The H8S/2600 and H8SX
CPU
cores
each
have
a
hardware MAC (Multiply and
Accumulate) block for extra
performance in applications
that involve data computa-
tions.
H8 MCU System
Performance
H8 microcontrollers are designed to
deliver high throughput for excellent
application performance.
For example, their CISC CPU cores
execute most instructions in just one
clock cycle, and their Advanced
Data
Management
peripherals
utilize a 3-bus architecture to speed
data transfers.
Also, the on-chip Flash can be
accessed in a single cycle, achieving
the
best
possible
performance
per MHz.
H8/300
H8/300H
H8S/2000
H8S/2600
H8SX
Basic Instructions Execution
2 cycles
1 cycle
Bus Width
8-bit
16-bit
32-bit
No. of Instructions
57
64
65
69
87
Address Space
64KB
16MB
4GB
9 MIPS
H8S/2000
@ 20 MHz
11 MIPS
H8S/2000
@ 25 MHz
15.2 MIPS
H8S/2600
@ 33 MHz
H8SX
@ 35 MHz
35 MIPS
H8SX
@ 50 MHz
50 MIPS
Dhrystone 1.1 MIPS value
40
30
20
10
50
Instruction
H8S
H8SX
MULXU.B
3
1
MULXU.W
4
1
MULXS.B
4
2
MULXS.W
5
2
MULU.W
-
2
MULU.L
-
5
MULS.W
-
2
MULS.L
-
5
MULU/U.L
-
6
MULS/U.L
-
6
CLRMAC
1
LDMAC
1
STMAC
2
1
MAC
4
Instruction
H8S
H8SX
DIVXU.B
12
10
DIVU.W
-
10
DIVXU.W
20
18
DIVU.L
-
18
DIVXS.B
13
12
DIVS.W
-
11
DIVXS.W
21
20
DIVS.L
-
19
H8 Family CPU Core Overview
Advanced Multiplier
execution cycles
Advanced Divider
execution cycles
相關(guān)PDF資料
PDF描述
VI-J12-IW-B1 CONVERTER MOD DC/DC 15V 100W
VI-J1P-IW-B1 CONVERTER MOD DC/DC 13.8V 100W
VI-J11-IW-B1 CONVERTER MOD DC/DC 12V 100W
VE-J1M-IW-B1 CONVERTER MINIMOD DC/DC 10V 100W
V375A36C500BG3 CONVERTER MOD DC/DC 36V 500W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DF3048VF8V 功能描述:MCU 3/5V 128K,PB-FREE 100-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設(shè)備:LCD,LVD,POR,PWM,WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB(32K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤
DF3048X16V 功能描述:MCU 5V 128K,PB-FREE 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設(shè)備:LCD,LVD,POR,PWM,WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB(32K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤
DF3052BF25V 功能描述:IC H8/3052BF MCU FLASH 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 標(biāo)準(zhǔn)包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C,SPI 外圍設(shè)備:欠壓檢測/復(fù)位,POR,PWM,WDT 輸入/輸出數(shù):11 程序存儲器容量:3.5KB(2K x 14) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 包裝:管件
DF3052BFI25V 制造商:Renesas Electronics Corporation 功能描述:MCU 5V 512K,PB-FREE 100-QFP - Trays
DF3052BX25V 功能描述:MCU 5V 512K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設(shè)備:LCD,LVD,POR,PWM,WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB(32K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤