THE PRODUCTS DESCRIBED" />
參數(shù)資料
型號: DG3409DB-T2-E1
廠商: Vishay Siliconix
文件頁數(shù): 6/15頁
文件大?。?/td> 0K
描述: IC MUX LV 8CH DUAL 4CH 16MICRO
標(biāo)準(zhǔn)包裝: 3,000
功能: 多路復(fù)用器
電路: 2 x 4:1
導(dǎo)通狀態(tài)電阻: 7 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 2.7 V ~ 12 V,± 3 V ~ 6 V
電流 - 電源: 1µA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFBGA
供應(yīng)商設(shè)備封裝: 16-Micro Foot?
包裝: 帶卷 (TR)
Document Number: 63273
www.vishay.com
Revision: 13-Jun-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
MICRO FOOT: 16-BUMP (4 mm x 4 mm, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
Notes
(unless otherwise specified)
a. Bump is lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Note
a. Use millimeters as the primary measurement.
DIM.
MILLIMETERSa
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.980
2.020
0.0780
0.0795
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3408
Recommended Land Pattern
0.5
6 X 0.150 ~ 0.229
Note b
Solder Mask ~ Pad Diameter + 0.1
Bump
Note a
32
1
A
B
e
D
e
A
A2
A1
S
E
Silicon
C
D
4
b Diameter
e
ECN: S11-1065-Rev. A, 13-Jun-11
DWG: 6000
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