4
FN3282.13
June 20, 2007
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
VL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) to (V+) +0.3V
Digital Inputs, VS, VD (Note 1). . . . . (V-) -2V to (V+) + 2V or 30mA,
Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20V (Max)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . .
≤20ns
Thermal Resistance (Typical, Note
2)θJA (°C/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
150
Maximum Junction Temperature (Plastic Packages). . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
(SOIC and TSSOP - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
2.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: V+ = +15V, V- = -15V, VL = 5V, VIN = 2.4V, 0.8V (Note 3), Unless Otherwise Specified.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
UNITS
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
RL = 300Ω, CL = 35pF, VS = ±10V (Figure 1) 25
-
110
175
ns
85
-
220
ns
Turn-OFF Time, tOFF
25
-
100
145
ns
85
-
160
ns
Break-Before-Make Time Delay
DG413 Only, RL = 300Ω, CL = 35pF (Figure 2) 25
-
25
-
ns
Charge Injection, Q (Figure
3)CL = 10nF, VG = 0V, RG = 0Ω
25
-
5
-
pC
RL = 50Ω, CL = 5pF, f = 1MHz
25
-
68
-
dB
Crosstalk (Channel-to-Channel),
(Figure 4)
25
-
-85
-
dB
Source OFF Capacitance, CS(OFF)
25
-
9
-
pF
Drain OFF Capacitance, CD(OFF)
25
-
9
-
pF
Channel ON Capacitance,
CD(ON) + CS(ON)
25
-
35
-
pF
DIGITAL INPUT CHARACTERISTICS
Input Current VIN Low, IIL
VIN Under Test = 0.8V, All Others = 2.4V
Full
-0.5
0.005
0.5
μA
Input Current VIN High, IIH
VIN Under Test = 2.4V, All Others = 0.8V
Full
-0.5
0.005
0.5
μA
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
IS = 10mA
Full
-15
-
15
V
Drain-Source ON Resistance,
rDS(ON)
IS = 10mA, VD = ±8.5V, V+ = 13.5V, V- = -13.5V
25
-
25
35
Ω
Full
-
45
Ω
±
DG411, DG412, DG413