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參數(shù)資料
| 型號： | DG417BDJ-E3 |
| 廠商： | VISHAY SILICONIX |
| 元件分類： | 多路復(fù)用及模擬開關(guān) |
| 英文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP8 |
| 封裝： | ROHS COMPLIANT, PLASTIC, DIP-8 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大?。?/td> | 340K |
| 代理商： | DG417BDJ-E3 |
NOTES:
1.
Die thickness allowable is 0.203
"0.0127.
2.
Dimensioning and tolerances per ANSI.Y14.5M-1994.
3.
Dimensions “D” and “E1” do not include mold flash or protrusions, and are
measured at Datum plane -H- , mold flash or protrusions shall not exceed
0.15 mm per side.
4.
Dimension is the length of terminal for soldering to a substrate.
5.
Terminal positions are shown for reference only.
6.
Formed leads shall be planar with respect to one another within 0.10 mm at
seating plane.
7.
The lead width dimension does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the lead width
dimension at maximum material condition. Dambar cannot be located on the
lower radius or the lead foot. Minimum space between protrusions and an
adjacent lead to be 0.14 mm. See detail “B” and Section “C-C”.
8.
Section “C-C” to be determined at 0.10 mm to 0.25 mm from the lead tip.
9.
Controlling dimension: millimeters.
10. This part is compliant with JEDEC registration MO-187, variation AA and BA.
11. Datums -A- and -B- to be determined Datum plane -H- .
12. Exposed pad area in bottom side is the same as teh leadframe pad size.
5
N N-1
A B C 0.20
(N/2) Tips)
2X
N/2
2
1
0.60
0.50
0.60
E
Top View
e
See Detail “B”
-H-
3
D
-A-
Seating Plane
A1
A
6
C
0.10
Side View
0.25
BSC
T
4
L
-C-
Seating Plane
0.07 R. Min
2 Places
Parting Line
Detail “A”
(Scale: 30/1)
0.48 Max
Detail “B”
(Scale: 30/1)
Dambar Protrusion
7
C
0.08 M
B S
A
S
b
b1
With Plating
Base Metal
c1
c
Section “C-C”
Scale: 100/1
(See Note 8)
See Detail “A”
A2
0.05 S
C
3
E1
-B-
End View
e1
0.95
Package Information
Vishay Siliconix
Document Number: 71244
12-Jul-02
www.vishay.com
1
MSOP:
8LEADS
JEDEC Part Number: MO-187, (Variation AA and BA)
N = 8L
MILLIMETERS
Dim
Min
Nom
Max
Note
A
-
1.10
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.25
-
0.38
8
b1
0.25
0.30
0.33
8
c
0.13
-
0.23
c1
0.13
0.15
0.18
D
3.00 BSC
3
E
4.90 BSC
E1
2.90
3.00
3.10
3
e
0.65 BSC
e1
1.95 BSC
L
0.40
0.55
0.70
4
N
8
5
T
0
_
4
_
6
_
ECN: T-02080—Rev. C, 15-Jul-02
DWG: 5867
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| DG417BDY-E3 | 功能描述:模擬開關(guān) IC Single SPST 20/25V RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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